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Overview
Advanced Semiconductor Engineering, Inc. (ASE Inc.) is the world’s largest independent providers of semiconductor packaging and test services. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, ASE Inc. develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group.
Semiconductors are the basic building blocks used to create electronic products and systems. Increasingly we are moving towards more sophisticated semiconductor applications, driven by market demands for faster, smarter, portable and integrated electronic products. In such products, the tiny semiconductor chip is constantly being pushed to greater limits.
Our services include wafer bumping, semiconductor packaging, design and production of interconnect materials, front-end engineering testing, wafer probing and final test services. We believe that we are better positioned than our competitors to meet the requirements of semiconductor companies worldwide for outsourced packaging and test services across a wide range of end-use applications.
Mission & Vision
We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems. ASE will act as an extension of our customers' own operations in achieving the maximum business objectives with minimum resources.