| 1984 |
Brothers Jason Chang and Richard
Chang established Advanced Semiconductor Engineering, Inc. Operations
began at the Company’s packaging facility located in Kaohsiung,
Taiwan in July. |
| 1989 |
ASE Inc.’s shares were listed on the Taiwan Stock Exchange
in July. |
| 1990 |
ASE Inc. purchased ETC Flextronics' testing
facility in Kaohsiung, Taiwan, and
renamed it ASE Test Limited. |
| 1991 |
ASE Inc. established packaging and testing facilities in Penang,
Malaysia. |
| 1992 |
ASE Inc. received ISO 9002 quality certification. |
| 1996 |
ASE Test Limited was listed on Nasdaq in June; the first Taiwan-based
company
to make a public offering in the US.
Incorporated ASE Material Inc. to establish in-house inter-connection materials
(substrates) capabilities. |
| 1997 |
ASE Inc. was certified by the Semiconductor
Assembly Council. |
| 1998 |
ASE Inc. was accredited by QS 9000 for product quality and
obtained ISO 14001
certification for environmental quality management. |
| 1999 |
Through ASE Test Limited, purchased a controlling
stake in ISE Labs, the largest IC testing company in the US,
a strategic acquisition that fortified ASE’s position as
a leader in IC testing services.
ASE Inc. acquired Motorola’s packaging and testing facilities in Chungli,
Taiwan and Paju, Korea.
ASE Inc. obtained controlling interest in Universal Scientific Industrial Co.,
Ltd. (USI), expanding into the scope of systems assembly. |
| 2000 |
ASE Inc. was listed on New York Stock Exchange through its
ADR issuance in October. |
| 2001 |
Established ASE Chungli Intelligent Industrial
Park - offering comprehensive
turnkey services under one roof. |
| 2003 |
ASE Group’s affiliates ASE (Chung-Li) Inc. and ASE Material
Inc. were merged
with ASE Inc. in October.
ASE Inc. and Compeg Manufacturing Co. Ltd. set up a joint venture in IC substrate
manufacturing, named ASE-Compeg Technologies, Inc. in October.
ASE Inc. became the world’s largest IC backend manufacturing company with
annual revenues surpassing the nearest competitor. |
| 2004 |
ASE Inc. acquires NEC Electronics’ IC
packaging and testing operation in Takahata, Japan in February.
This acquisition enables ASE to enhance its presence and ramp
up market share with Japanese IDM (integrated device manufacturer)
customers.
20th Anniversary of ASE Group |
| 2005 |
Won the Outstanding Award at the 13th Industrial Technology Development Awards hosted by the Ministry of Economic Affairs in Taiwan. |
| 2006 |
Transferred its existing semiconductor material business department to its wholly owned subsidiary, ASE Electronics Inc., to strengthen its core competences and to further develop its material business.
ASE and Powerchip formed joint venture to establish PowerASE Technology Inc, focusing on packaging and test services for the memory IC market. |
| 2007 |
ASE and NXP Semiconductors launched ASEN, a joint venture providing IC packaging and test services in Suzhou, China, and offering a variety of package types, such as low pin count QFN, LFBGA, SO, TSSO, and other common packages for mobile applications.
ASE Group integrated GAPT in Shanghai, China and renamed the company ASE Assembly & Test (Shanghai) Ltd. |
| 2008 |
Acquired Aimhigh's manufacturing facility. Located in Wei Hai city, Shandong, China and specialized in lower pin count products, ASE offers significant cost advantages for discrete product manufacturing. |
