Maximum with Minimum
 
The integrated circuit (IC) chip was invented in 1959. Today, the increase in sophistication of the tiny yet powerful chip is an enabling factor in the rise of the Internet, the proliferation of e-business, the flourishing of wired and wireless communications, the vividness of entertainment boxes and the intelligence of machines and equipment.

The inventors of the IC chip, Jack Kilby and Robert Noyce, were driven by the desire of making more of less. At ASE, we adopt a similar aspiration - Maximum with Minimum.

Engineers continue to pack more functions onto an increasingly shrinking chip, while demanding higher performance and greater speed from the chip. There is, however, a great challenge to how small the chip size can be reduced without affecting desired results. This is where chip packaging (also known as semiconductor packaging or assembly) and testing play an ever more crucial role.

Packaging serves to protect the chip and facilitate electrical connections while testing determines that the chip performs according to performance specifications.