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Increased sophistication, complexity
and miniaturization of systems are speeding up developments
in advanced packaging technology.
It can be more cost-effective for companies to rely on independent specialist
assembly and test houses to substantially reduce their backend
production costs.
Effective utilization of independent semiconductor manufacturing services
enables integrated device manufacturers (IDMs) and fabless companies to
maximize revenue while minimizing costs. These companies are consequently
better able to focus on their core competencies such as IC design and end-product
marketing.
ASE Group offers stand-alone backend manufacturing services in areas ranging
from engineering test and package design to substrate manufacturing, assembly,
final test and DMS to complement customers' own manufacturing processes.
We also offer customers a fully integrated semiconductor manufacturing
supply chain. With our flagship manufacturing facilities located in the
heart of one of the world's major centers for semiconductor manufacturing,
known as the Taiwan cluster, we leverage strategic partnerships with the
world's largest wafer foundries, TSMC and UMC. This enables our customers
to take advantage of the fully integrated front-end and back-end semiconductor
manufacturing services offered by the silicon island.
Given the increasing significance of substrates in the process of
IC packaging, ASE is aggressively expanding into substrate
manufacturing. Customers can benefit from timely access to material source.
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