The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group.

Semiconductors are the basic building blocks used to create electronic products and systems. Increasingly we are moving towards more sophisticated semiconductor applications, driven by market demands for faster, smarter, portable and integrated electronic products. In such products, the tiny semiconductor chip is constantly being pushed to greater limits.

Semiconductor manufacturing consists of many processes - design of the integrated circuit (IC), preliminary testing of the viability of the design, wafer fabrication, packaging and final testing of the IC.



Our Capabilities

ASE is capable of providing services at all stages of the semiconductor manufacturing process, with the exception of wafer fabrication.

Our service capabilities range from front-end engineering testing, wafer probing, packaging and final test. We also provide design manufacturing service from board design to systems assembly through Universal Scientific Industrial Ltd., an ASE group member.

Front-end engineering test is the testing of semiconductor prototypes before they go into volume production. Our services include software development, electrical verification, reliability analysis and failure analysis.

Wafer probing is a process whereby each individual die (chip) on the wafer is tested for defects to identify operable semiconductors for packaging.

Packaging, also known as assembly, is the processing of bare semiconductors into finished semiconductors, serving to protect the die and facilitate electrical connections and heat dissipation. We offer a broad range of semiconductor packages meeting the diverse function and cost requirements of our customers.

Final testing of semiconductors ensures that they function properly before being shipped to customers or assembled in electronic products.



Members of the ASE Group

Advanced Semiconductor Engineering Inc. (www.asetwn.com.tw) (TAIEX: 2311, NYSE: ASX), a leading supplier of semiconductor assembly and test services.

Universal Scientific Industrial Inc. (www.usi.com.tw), a leading electronic manufacturing service provider.



Industry Leadership

Historically, semiconductor companies designed, manufactured, packaged and tested IC chips in their own facilities (also known as integrated device manufacturers). In recent years, there has been a growing trend for these companies to outsource stages of the manufacturing process for strategic reasons, enabling them to focus on their core competencies such as design and integration, and meeting increasing demands in capacity. There has also been an increasing number of 'fabless' design houses, which are companies that specialize in integrated circuit design and marketing but do not have in-house manufacturing capabilities.

ASE, with its leading technology capabilities and excellent service quality, has been a benefactor of these developing trends and is now the world’s number one independent provider of semiconductor packaging and test services. Positioned as a complete back-end manufacturing service provider, ASE offers customers turnkey services for integrated test, packaging, design manufacturing services (DMS) and direct shipment.

State-of-the-art Process Technologies

As the industry focuses on integrating more functions onto a single chip and chip performance increases with improvements in process technologies, packaging has gained even greater importance. Computing frequency of next generation chips are becoming higher and functions packed onto each chip are increasing. Consequently, requirements for thermal and electrical reliability are rising exponentially. Semiconductor designers need to explore advanced packaging methods to satisfy these requirements.

Innovation and quality are values that ASE prides itself for delivering leading-edge technologies and solutions to customers, meeting their demanding requirements such as electrical performance, heat dissipation, cost and aggressive cycle time. ASE continues to invest the maximum in research and development through its high caliber engineering teams and advanced manufacturing processes.

The advanced manufacturing process technologies that we provide include flip chip and wafer bumping, 300mm wafer bumping and test, Chip Scale Packaging(CSP), 3D packages and System in Package(SiP). We also offer standard products such as PDIP, SOJ, SSOP and PLCC. Our broad product portfolio provides customers the flexibility to select package types that best suit the needs of their chip designs.

ASE has also developed lead-free solutions to eliminate lead in electronic interconnections from both the legislative and competitive sides. We have investigated and tested the performance of various types of lead free solders to generate alternative semiconductor package applications that grant our customers environmentally-friendly chip packages without compromising the reliability.