| ASE Group is the world’s
number one independent provider of semiconductor packaging
and test services. With over 200 customers
worldwide, we offer a wide array of services in order to satisfy
the diverse needs of each and every one of these customers. |
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| Assembly Service: |
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| PBGA, HSBGA, MCM BGA, Side by Side,
Stacked, Low & Thin, T(F)BGA, L(F)BGA, Film BGA,
Cavity Down BGAs, Viper BGA, CSBGA, Tape BGA, UFPBGA,
EPBGA, GTPAC |
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| FC-BGA, HP FC-BGA, FC-CSP |
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VFBGA,  BGA,
COS, Leadless, CLCC, QFN,BCC/BCC+/BCC++, LGA |
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| PLCC, QFP, LQFP/TQFP, HQFP,
CLCC |
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| PDIP, SOJ, SOP/SSOP, TSOP(I), TSP(II),
SOIC, PFP, HSOP |
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| Solder Bumping, Gold Bumping, 300mm
Wafer Bumping, Ultra
CSP |
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| 3D Package |
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| TCP |
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| RF Power, COB |
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Image Sensor
-4/6 Lead open Cavity Unibod-Pressure Sensor
-Open Cavity Surface Mount-Pressure Sensor
-Open Cavity Pak-Pressure Sensor |
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RF module
-RF Integrated Module |
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| Test
Service: |
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Integrated Qualification
Labs
Digital Testing Services
ESD Testing
HAST
BIS Burn-in
Failure Analysis
Thermal Cycling
Kineticon
Scanning Acoustic Microscopy(SAM)
IC Qualification
Latch-Up Testing
Wafer Sort
Engineering Test
Final Test
Burn-in
Top Mark
Package Lead Inspection
Tape & Reel
Dry Pack |
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| Design Manufacturing Service (DMS): |
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Communication
Computing
Visual & Applied Devices
Automotive & Electronics Packaging |
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