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Stress and reliability characterization is used to analyze stress issues and package reliability by numerical simulation and measurement. The analysis includes root cause investigation into packaging failure such as die crack, delamination, and optimal design for low stress and high reliability. Characterization also provides component and system-level stress analyses to predict the fatigue life of solder joints, like temperature-cycling-test (TCT), drop test, bending test, and other reliability tests. The characterization services include:
Thermal Stress Characterization
Warpage & component stress prediction
Warpage & component stress measurement
Packaging material selection & structure design
Material mechanical properties measurement and test
Package level reliability analysis
Die strength flexural test
Die pull test to evaluate UBM/Bump structural integrity
Process Simulation
Die-boding process dynamic simulation
Solder bump / joint shape prediction
Board Level Reliability Test and Simulation
Temperature cycling test
Cyclic bend test
Drop / shock test
Failure analysis
Solder joint reliability (fatigue) prediction
Wire-bonding process dynamic simulation
Vibration Test
Ball Impact Test |
