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The stress & reliability characterization is used
to analyze the stress
issues and package reliability by numerical simulation and measurement.
The analysis also consists of root cause investigation into packaging
failure ( like die crack, delamination) and optimal design for low stress
and high reliability. The characterization also provides component and
system-level stress analyses to predict the fatigue life of solder joints,
like temperature-cycle-test (TCT), bending test, and other reliability
tests.
The characterization services include:
Thermal Stress Characterization
 Warpage & component
stress prediction
Warpage & component
stress measurement
Packaging
material selection & structure design
Material
properties measurement and test
Package
level reliability analysis
Die
strength flexural test
Die
pull test to evaluate UBM / Bump structural integrity
Process Simulation
Die-boding
process dynamic simulation
Solder
bump/ joint shape prediction
Board Level Reliability Test
and Simulation
Temperature
cyclic test
Bend
cyclic test
Drop
test
Failure
analysis
Solder
joint reliability ( fatigue ) prediction
Wire-bonding
process dynamic simulation
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JA ( junction-to-ambient
)
JT (
junction-to-top )
