We strongly believe continued innovation is the key to adding value to customers' chip designs. We therefore invest heavily in research and development, maintaining one of the best teams in the industry with over 500 engineers. Our cutting-edge technologies help enable the most advanced microelectronic inventions.

As a leader in advanced IC-assembly technologies, ASE offers leading-edge total back- end solutions, including 300 mm wafer technologies, copper wafer process, flip chip technology, multi stack-die package, SiPs (System in Package), stacked-die and many more. ASE provides a full spectrum of assembly services covering conventional packages such as PDIP and SOIC; BGA (Ball Grid Array) packages, and advanced packages such as SiP, multi-stacked die packages and flip-chip technology. We are the industry leader in fine-pitch bonding with the world's largest manufacturing capacity.