ASE Global

Dual-in-Line PDIP

Product Overview

Pastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole PTH technology. It is widely used in low cost and manual applications. ASE offers PDIP with lead counts ranging from 8 to 64 leads and package width from 7.62mm (300 mil) to 17. 78mm (700 mil). For package size reduction, ASE offers two alternatives-the narrow body type , Skinny PDIP ( width is 300mil, lead count is 24, 28 ) and the narrow lead pitch type, Shrink PDIP or SDIP ( lead pitch is 1.78mm or 70mil, lead count is 32, 56, 64 ).

Application

Dual-in-line packages are considered one of the most established industry standard packages. PDIP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.

Features

300 mil body width: 8, 14, 16, 18, 20, 24, 28 available lead count
400 mil body width: 32 available lead count
600 mil body width: 24, 28, 32, 40, 42, 48, 56 available lead count
700 mil body width: 64 available lead count
JEDEC standard compliant
Wide choice of pad sizes to meet die size per customer lead frame design capability
Pb-free process ready and available

Reliability

Package Level

Design Rule

Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping

Minimum Sawing street width: 3.0 mil (76.2 um)

Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range

(1mm=39.37mil; 1mil=25.4um)

Performance

Electrical

Electrical Characterization (Contact ASE R&D for details.)

PDIP
	iframe here

(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.

Thermal (Contact ASE R&D for details.)

Standard Process/Materials

Optional process: wafer back grinding / die coating/ topside ink marking/ dry packing.

Package Offering

The alphabetical notation refers to:

A2 Body thickness

L1 Lead length

b Lead width

c L/F thickness

e Lead pitch

Packing & Shipping

Tube.