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Dual-in-LineSOP/SSOP
Product
Overview
The features of the small outline package (SOP) are similar to SOJ, except the leads' end is formed in the shape of gull-wings. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50 mil) to 0.635mm (25 mil). The shrunk body results in flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.
Application
ASE's SOP/SSOP product was designed in compliance with JEDEC standard. The application includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video and information appliances.
Features
SOP body sizes 150 up to 450 mils
SSOP body sizes 300 mils
SOP lead counts available from 8 to 32
SSOP lead counts available 48 & 56
JEDEC standard outlines
Existing BOM and process flow
Pb-free process ready and available
Reliability
Package
Level
Design
Rule
Minimum
Ink Size:15mil (381
um) diameter or non-ink with wafer mapping
Minimum
Sawing street width:3.0 mil (76.2
um)
Wafer
Thickness:Back grinding
is required if the thickness exceeds ASE's stipulated
range
Minimum Spacing between Die Edge and Lead Frame Paddle Edge (A): 8 mil (0.2) without ground bond/ 30 mil (0.76 mm) with ground bond.
Minimum Bond Pad Pitch (In Line) (B): 2.95 mil (75 um).
Minimum Bond Pad Pitch (Staggered) (C): NA.
Minimum Bond Pad Opening (D): In Line: 2.48 mil (63 um) Staggered: NA.
Maximum Wire Length (L): 176 mil (4.470 MM) (For 25 um Gold Wire).
Performance
Electrical
Electrical
Characterization (Contact ASE R&D
for details.)
SSOP
(1mm=39.37mil;
1mil=25.4um)
The above electrical data is for reference only.
Thermal
(Contact ASE R&D for details.)
Standard
Process/Materials
Optional process: wafer back grinding / die coating/ topside ink marking/ dry packing
SOP body sizes 150 up to 450 mils
