Dual-in-Line SOP/SSOP
 

Product Overview

 

The features of the small outline package (SOP) are similar to SOJ, except the leads' end is formed in the shape of gull-wings. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50 mil) to 0.635mm (25 mil). The shrunk body results in flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.



Application

 

ASE's SOP/SSOP product was designed in compliance with JEDEC standard. The application includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video and information appliances.



Features

 

SOP body sizes 150 up to 450 mils
SSOP body sizes 300 mils
SOP lead counts available from 8 to 32
SSOP lead counts available 48 & 56
JEDEC standard outlines
Existing BOM and process flow
Pb-free process ready and available



Reliability

 
Package Level



Design Rule

 

Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping

 
Minimum Sawing street width: 3.0 mil (76.2 um)
 
Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range
 
 
Minimum Spacing between Die Edge and Lead Frame Paddle Edge (A): 8 mil (0.2) without ground bond/ 30 mil (0.76 mm) with ground bond.
Minimum Bond Pad Pitch (In Line) (B): 2.95 mil (75 um).
Minimum Bond Pad Pitch (Staggered) (C): NA.
Minimum Bond Pad Opening (D): In Line: 2.48 mil (63 um) Staggered: NA.
Maximum Wire Length (L): 176 mil (4.470 MM) (For 25 um Gold Wire).



Performance

 

Electrical

 
Electrical Characterization (Contact ASE R&D for details.)
 
SSOP  
(1mm=39.37mil; 1mil=25.4um)
The above electrical data is for reference only.
 
Thermal (Contact ASE R&D for details.)



Standard Process/Materials

 
Optional process: wafer back grinding / die coating/ topside ink marking/ dry packing



Package Offering

 
The alphabetical notation refers to:
A1 Stand-off
A2 Body thickness
L1 Lead length
b Lead width
c L/F thickness
e Lead pitch
Overall thickness is the sum of A1 and A2.
 



Packing & Shipping