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Dual-in-Line SOP/SSOP
 

Product Overview

 

The features of small outline package (SOP) are similar to SOJ, except that the leads' end is formed in the shape of a gull-wing. SSOP is the shrunk version of SOP, with lead pitch narrowed from 1.27mm (50mil) to 0.635mm (25mil). The shrunk body means flexible layout within finite PCB area. Another advantage is that shorter leads improve the electrical performance.


Application

 

ASE’s SOP/SSOP product was designed in compliance with JEDEC standards. Applications includes low pin count packages used in cellular phones, wireless LAN, personal digital assistants, digital cameras, video, and information appliances.


Features
 
SOP Body sizes 154 up to 450 mils
SSOP Body sizes 300 mils
SOP lead counts available from 8 to 32
SSOP lead counts available 48 & 56
JEDEC standard outlines
Existing BOM and process flow
Pb-free process ready and available


Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30ºC/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65ºC to 150ºC, 100/300/500/1000 cycles
HAST JEDEC 22-A118 130ºC/85% RH, 33.5 PSI 48/96 hrs
HTST JEDEC 22-A103-B 150ºC, 500/1000 hrs
THT JEDEC 22-A101-B 85’C/85%RH 500/1000 hrs
PCT JEDEC 22-A102 121ºC/100%RH/15 psi ,96/168 hours
Thermal shock test JEDEC JESD22-A106 -65ºC~150ºC, 100 / 300 / 500 cycles
 
Board Level (Contact ASE for further details.)


For more information, please contact ASE sales office.


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