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Dual-In-LineTSOP(I)/TSOP(II)
Product
Overview
TSOP(I)/TSOP(II ) /TSOP(II ) Tape-LOC
TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(I) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side.
Application
Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones and memory modules. LOC technology can be applied to TSOP(II).
Telecommunication Products:
Cellular Phone
Wireless LAN
Portable Products:
Personal Digital Assistants
Digital Camera
Audio/Video
Low Pin Count Packages:
Information Appliances
Features
Low profiles and lightweight Existing BOM Steady yield Low cost Pb free process ready and available TSOP(I) body sizes from 11.8x 8 up to 18.4x12 mils TSOP(II) body sizes from 17.1x 7.6 up to 22.2x10.2 TSOP(I) lead counts available 28/32/40/ 48 TSOP(II) lead counts available 20/24/40/44/50/54 JEDEC standard outlines Existing BOM and process flow
Reliability
Package
Level
JEDEC
precondition level 3
Visual
Inspection
Open/Short
Test
SAT
Inspection
Temperature
Cycling
150°C~-65°C/ 5
Cycles
Baking
@ 125°C/24 Hours
Moisture
Soak
30°C/ 60%RH/ 192
Hours
IR
Reflow
225°C/3X (Pb-free: 260°C/ 3X)
Visual
Inspection
Open/Short
Test
SAT
Inspection
Temperature/Humidity test
85°C/ 85%RH, 500/ 1000 hours
Thermal
Shock
-65°C~150°C, 100/ 300/ 500 cycles
Pressure
Cooker Test
121°C/ 100%RH/ 15 psig, 96/ 168/ 300 hours
Temperature
Cycles
-65°C~150°C, 100/ 300/ 500/ 1000 cycles
HTST
150°C, 500/ 1000 hours
HAST
130°C/85%RH, 50/ 100 hours
Board
Level (Contact
ASE R&D for details.)
Design
Rule
Minimum
Ink Size:15mil (381
um) diameter or non-ink with wafer mapping
Minimum
Sawing street width:3.0 mil (76.2
um)
Wafer
Thickness:Back grinding
is required if the thickness exceeds ASE's stipulated
range
(1mm=39.37mil; 1mil=25.4um)
Performance
Electrical
Electrical
Characterization (Contact ASE R&D
for details.)
Thermal
(1mm=39.37mil;
1mil=25.4um)
The
above thermal data is for reference only.
Standard
Process/Materials
Optional process: wafer back grinding/ die coating/ topside Ink marking/dry packing
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Low profiles and lightweight
