Dual-In-Line TSOP(I)/TSOP(II)
 


Product Overview

 

TSOP(I)/TSOP(II ) /TSOP(II ) Tape-LOC
TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(I) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side.



Application

 

Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones and memory modules. LOC technology can be applied to TSOP(II).

Telecommunication Products:
Cellular Phone
Wireless LAN

Portable Products:
Personal Digital Assistants
Digital Camera
Audio/Video

Low Pin Count Packages:
Information Appliances



Features

 

Low profiles and lightweight
Existing BOM
Steady yield
Low cost
Pb free process ready and available
TSOP(I) body sizes from 11.8x 8 up to 18.4x12 mils
TSOP(II) body sizes from 17.1x 7.6 up to 22.2x10.2
TSOP(I) lead counts available 28/32/40/ 48
TSOP(II) lead counts available 20/24/40/44/50/54
JEDEC standard outlines
Existing BOM and process flow



Reliability

 
Package Level
JEDEC precondition level 3  
Visual Inspection  
Open/Short Test  
SAT Inspection  
Temperature Cycling 150°C~-65°C/ 5 Cycles
Baking @ 125°C/24 Hours  
Moisture Soak 30°C/ 60%RH/ 192 Hours
IR Reflow 225°C/3X (Pb-free: 260°C/ 3X)
Visual Inspection  
Open/Short Test  
SAT Inspection  
Temperature/Humidity test 85°C/ 85%RH, 500/ 1000 hours
Thermal Shock -65°C~150°C, 100/ 300/ 500 cycles
Pressure Cooker Test 121°C/ 100%RH/ 15 psig, 96/ 168/ 300 hours
Temperature Cycles -65°C~150°C, 100/ 300/ 500/ 1000 cycles
HTST 150°C, 500/ 1000 hours
HAST 130°C/85%RH, 50/ 100 hours
Board Level  (Contact ASE R&D for details.)


Design Rule

 

Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping

 
Minimum Sawing street width: 3.0 mil (76.2 um)
 
Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range
 
 

(1mm=39.37mil; 1mil=25.4um)



Performance

 

Electrical

 
Electrical Characterization (Contact ASE R&D for details.)
 
Thermal
 
(1mm=39.37mil; 1mil=25.4um)
The above thermal data is for reference only.



Standard Process/Materials

 
Optional process: wafer back grinding/ die coating/ topside Ink marking/dry packing



Package Offering

 

The alphabetical notation refers to:
A1 Stand-off
A2 Body thickness
L1 Lead length
b Lead width
c L/F thickness
e Lead pitch
Overall thickness is the sum of A1 and A2.
 



Packing & Shipping