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Dual-in-Line TSOP(I)/TSOP(II)

Product Overview

TSOP(I)/ TSOP(II)
TSOP(I) and TSOP(II) are thin profile small outline packages with an overall thickness of as thin as 1.1mm (cf. 2.6~2.8mm for SOP of the same I/O). TSOP(I) and TSOP(II) differ in the location of leads. TSOP(II) lines its leads on the narrow side, while TSOP(II) lines up its leads on the wide side.

Application

Due to its thin profile, TSOP is suitable for applications in portable electronic products, cell phones, and memory modules.

Telecommunication Products
Cellular Phone
Wireless LAN

Portable Products
Personal Digital Assistants
Digital Camera
Audio/Video

Low Pin Count Packages
Information Appliances

Features

Low profiles and lightweight

Steady yield

Low cost

Pb-free Process ready and available

TSOP(I) body size from 11.8x8 up to 18.4x12mils

TSOP(II) body size from 17.1x7.6 up to 22.2x10.2mils

TSOP(I) lead counts available 28/32/40/48

TSOP(II) lead counts available 20/24/40/44/50/54

JEDEC standard outlines

Existing BOM and process flow

Reliability

Package Level

Test Item	Reference Standard	Condition/Duration
MSL	JEDEC 22-A103	Level 3, 30°C/60% RH, 192 hrs
TCT	JEDEC 22-A104-B	-65°C to 150°C, 100/300/500/1000 cycles
HAST	JEDEC 22-A118	130°C/85% RH, 33.5 PSI 48/96 hrs
HTST	JEDEC 22-A103-B	150°C, 500/1000 hrs
THT	JEDEC 22-A101-B	85°C/85%RH 500/1000 hrs
PCT	JEDEC 22-A102	121°C/100%RH/15 psi ,96/168 hours

Board Level (Contact ASE for further details.)

For more information, please contact ASE sales office.