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Product
Overview |
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Small Outline J-leaded (SOJ ) package is similar to PDIP, but the leads' end are formed in a “J”- shape to be folded under the body. This aims to reduce the foot space. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP.
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Application |
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Telecommunication Products:
Cellular Phone
Wireless LAN
Portable Products:
Personal Digital Assistants
Digital Camera
Audio/Video
Low Pin Count Packages:
Information Appliances
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Features |
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 Low profiles and lightweight
Steady yield
Low
cost
SOJ body sizes from 710 up to 1125 mils
Pb-free Process ready and available
JEDEC standard outlines
Existing BOM and process flow
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Reliability |
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| Package
Level |
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| JEDEC
precondition level 3 |
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| Visual
Inspection |
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| Open/Short
Test |
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| SAT
Inspection |
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| Temperature
Cycling |
150°C~-65°C/ 5 cycles |
| Baking
@ 125°C/24 Hours |
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| Moisture
Soak |
30°C/ 60%RH/ 192 hours |
| IR
Reflow |
225°C/ 3X (Pb-free: 260°C/ 3X) |
| Visual
Inspection |
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| Open/Short
Test |
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| SAT
Inspection |
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| Temperature/Humidity
test |
85°C/ 85%RH, 500/ 1000 hours |
| Thermal
Shock |
-65°C~150°C, 100/ 300/ 500 cycles |
| Pressure
Cooker Test |
121°C/ 100%RH/ 15 psig, 96/ 168/ 300 hours |
| Temperature
Cycles |
-65°C~150°C, 100/ 300/ 500/ 1000 cycles |
| HTST |
150°C, 500/ 1000 hours |
| HAST |
130°C/85%RH, 50/ 100 hours |
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| Board
Level (Contact
ASE R&D for details.) |
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Design
Rule |
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Minimum
Ink Size:
15mil (381
um) diameter or non-ink with wafer mapping |
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| Minimum
Sawing street width:
3.0 mil (76.2
um) |
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| Wafer
Thickness:
Back grinding
is required if the thickness exceeds ASE's stipulated
range |
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| Minimum Spacing between Die Edge and Lead Frame Paddle Edge (A): 8 mil (0.2 mm) without ground bond/ 30 mil (0.76 mm) with ground bond. |
| Minimum Bond Pad Pitch (In Line) ( B ): 2.95 mil (75 um). |
| Minimum Bond Pad Pitch (Staggered) (C): NA. |
| Minimum Bond Pad Opening (D): In Line: 2.48 mil (63 um) Staggered: NA. |
| Maximum Wire Length (L): 176 mil (4.470 MM) (For 25 um Gold Wire). |
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Performance |
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| Electrical
Characterization (Contact ASE R&D
for details.) |
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| Thermal |
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| (1mm=39.37mil;
1mil=25.4um) |
| The
above thermal data is for reference only. |
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Standard
Process/Materials |
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| Optional process: wafer back grinding / die coating/ topside ink marking/ dry packing |
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Package
Offering |
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| The
alphabetical notation refers to: |
| A1
Stand-off |
| A2 Body
thickness |
| b
Lead width |
| c L/F
thickness |
| e
Lead pitch |
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| Overall
thickness is the sum of A1 and A2. |
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| Shipping |
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