ASE Group TOP > Products > Assembly Offerings > Dual-in-Line > SOJ
Dual-in-Line SOJ
 

Product Overview

 

Small Outline J-leaded (SOJ) package is similar to PDIP, but the leads’ end are formed in a “J”-shape to be folded under the body. This aims to reduce the foot print. With the increasing popularity of SMT and with a smaller outline than PDIP, SOJ is widely used to complement PDIP.


Application

 

Telecommunication Products
Cellular Phone
Wireless LAN

Portable Products
Personal Digital Assistants
Digital Camera
Audio/Video

Low Pin Count Packages
Information Appliances


Features
 
Low profiles and lightweight
Steady yield
Low cost
SOJ body sizes from 710 up to 1125 mils
Pb-free Process ready and available
JEDEC standard outlines
Existing BOM and process flow


Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 100/30/500/1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
PCT JEDEC 22-A102 121°C/100%RH/15 psi, 96/168 hours
Thermal shock test JEDEC JESD22-A106 -65°C~150°C, 100/300/500 cycles

 
Board Level  (Contact ASE for further details.)


For more information, please contact ASE sales office.


© 2004 - 2009 ASE Group. All rights reserved. Terms of Use