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Product Overview |
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| Discrete packages are mainly separated Through Hole Device (THD) & Surface Mounting Device (SMD) type which are molded epoxy molding compound. According to JEDEC standards, there are several kinds of mold & lead shapes. |
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| Applications |
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| ASE Discrete THD package is optimized for using power device (SMP, motor, transformer in LCD/PDP TV, PC, Audio, Automotive area) and also SMD Package is designed for small signal module (Cellular phone, MP3, Camera, potable electronic device, etc.) |
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Features |
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| Discrete Package is suitable for high, low power and high speed switching, also several kind of solution and application area requiring High reliability & low consumption. |
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| Package Offering |
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| 1. THD (Through Hole Device) Type |
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TO-92 |
TO-126 |
TO-220 |
TO-220FP |
TO-247 |
TO-264 |
TO-3P |
| Outline |
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Dimension
(mm)
(L*W*H) |
19.05
4.58
3.86 |
27.26
8.00
3.25 |
28.78
9.90
4.50 |
28.85
10.16
4.70 |
41.07
15.95
5.03 |
46.61
19.98
4.97 |
39.90
15.60
4.80 |
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| 2. SMD (Surface Mounting Device) Type |
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SOT-23 |
SOT-223 |
SOT-89 |
SOT-323 |
SOT-343 |
SOT-363 |
SOP-8L |
TO-252 |
TO-263 |
| Outline |
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Dimension
(mm)
(L*W*H) |
19.05
4.58
3.86 |
27.26
8.00
3.25 |
28.78
9.90
4.50 |
28.85
10.16
4.70 |
41.07
15.95
5.03 |
9.15
6.60
2.30 |
15.30
9.90
4.50 |
9.15
6.60
2.30 |
15.30
9.90
4.50 |
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| 2.9x1.3mm to 46.61x19.88mm package |
| 2 lead to 3 lead counts |
| Low assembly cost |
| Thermal and electrical performance |
| Good power dissipation |
| JEDEC standard outlines |
| Lead free process available |
| Full In-house assembly & test capability |
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| Reliability |
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| Test Item |
Reference Standard |
Condition/Duration |
| MSL |
JEDEC22-A103 |
Level 3, 30°C/60% RH, 192 hrs |
| TCT |
JEDEC 22-A104-B |
-65°C to 150°C, 500, 1000 cycles |
| HAST |
JEDEC 22-A118 |
130°C/85% RH, 33.5 psi 96 hrs |
| HTST |
JEDEC 22-A103-B |
150°C, 500/1000 hrs |
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