QUAD PLCC
 

Product Overview

 
PLCC
 
Plastic Leaded Chip Carrier (PLCC) is widely used in micro-controllers and consumer electronics. Each lead of the PLCC is formed into a J-shape and folded under the package body. ASE provides PLCC packaging services in compliance with JEDEC standards. Lead count ranges from 20 to 84 with 1.27mm (50mil) lead pitch.
 
PLCC with Drop-in Heat Spreader
 
The addition of a drop-in heat spreader allows more than 50% power dissipation compared to conventional packages. The drop-in HS drives off the heat from the chip easily by extending the conduction area and transfers more heat via the lead frame. PLCC with drop-in HS is applicable to 84 leads.


Application
 
ASE's PLCC product was designed in compliance with JEDEC standards for 'J' shape leaded SMT packages. Its robust leads and smaller foot print makes it applicable for surface mount and replaceable plug-in assembly via sockets. Design applications include memory, processors and controllers, ASIC, DSP, PC chipset device for consumer product, automotive and aerospace.


Features

 

453~1153 mils body sizes
28~84 available lead counts
JEDEC standard compliant
Wide selection of pad size to die size
High conductivity lead frame
Wide selection of pad size to meet die size per customer's lead frame design capability
Pb free process ready and available



Reliability

 
Package Level
 

All the quad packages selected for temperature/humidity test and temperature cycles are subjected to precondition process per JEDEC moisture LEVEL3 prior to environmental stress. Test criterion is zero defect out of 45 sample units.

 



Design Rule

 

Minimum Ink Size: 15mil (381 um) diameter or non-ink with wafer mapping

 
Minimum Sawing street width: 3.0 mil (76.2 um)
 
Wafer Thickness: Back grinding is required if the thickness exceeds ASE's stipulated range
 
 

(1mm=39.37mil; 1mil=25.4um)



Performance

 
Electrical (Contact ASE R&D for details.)
 
Thermal (Contact ASE R&D for details.)
 
PLCC  
The above electrical data is for reference only.



Standard Process/Materials

 
Optional process: wafer back grinding/die coating/ topside ink marking/ dry packing.



Package Offering

 
The alphabetical notation refers to:
A1 Stand-off
A2 Body thickness
b Lead width
c L/F thickness
e Lead pitch
 
Overall thickness is the sum of A1 and A2.
 



Packing & Shipping