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QUAD PLCC
 

Product Overview

 
PLCC
Plastic Leaded Chip Carrier (PLCC) is widely used in micro-controllers and consumer electronics. Each lead of the PLCC is formed into a “J”-shape and folded under the package body. ASE provides PLCC packaging services in compliance with JEDEC standard. Lead count ranges from 20 to 84 with 1.27mm (50mil) lead pitch.


Application
 
ASE’s PLCC product was designed in compliance with JEDEC standard for ‘J’ shape leaded SMT packages. Its robust leads and smaller foot space makes it applicable for surface mount and replaceable plug-in assembly via sockets. Design applications include memory, processors and controllers, ASIC, DSP, PC chipset device for consumer product, automotive and aerospace.


Features
 
453~1153mils body sizes
28~84 available lead counts
JEDEC standard compliant
Wide selection of pad size to die size
High conductivity lead frame
Wide selection of pad size to meet die size per customized lead frame design capability
Pb-free process ready and available


Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A113 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 100/300/500/1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 PSI 48/96 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs
THT JEDEC 22-A101-B 85°C/85%RH 500/1000 hrs
PCT JEDEC 22-A102 121°C/100%RH/15 psi ,96/168/300 hours
Thermal shock test JEDEC JESD22-A106 -65ºC~150ºC, 100 / 300 / 500 cycles



For more information, please contact ASE sales office.


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