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QUADPLCC
Product
Overview
PLCC
Plastic Leaded Chip
Carrier (PLCC) is widely used in micro-controllers
and consumer electronics. Each lead of the PLCC
is formed into a J-shape and folded under the
package
body. ASE provides PLCC packaging services in compliance
with JEDEC standards. Lead count ranges from 20
to
84 with 1.27mm (50mil) lead pitch.
PLCC with
Drop-in Heat Spreader
The addition of a
drop-in heat spreader allows more than 50% power
dissipation compared to conventional packages. The
drop-in HS drives off the heat from the chip easily
by extending the conduction area and transfers more
heat via the lead frame. PLCC with drop-in HS is
applicable to 84 leads.
Application
ASE's
PLCC product was designed in compliance with JEDEC
standards for 'J' shape leaded SMT packages. Its
robust leads and smaller foot print makes it applicable
for surface mount and replaceable plug-in assembly
via sockets. Design applications include memory,
processors and controllers, ASIC, DSP, PC chipset
device for consumer product, automotive and aerospace.
Features
453~1153 mils body sizes
28~84 available lead counts
JEDEC standard compliant
Wide selection of pad size to die size
High conductivity lead frame
Wide selection of pad size to meet die size per
customer's lead frame design capability
Pb free process ready and available
Reliability
Package
Level
All the quad packages selected for temperature/humidity
test and temperature cycles are subjected to precondition
process per JEDEC moisture LEVEL3 prior to environmental
stress. Test criterion is zero defect out of 45
sample units.
Design
Rule
Minimum
Ink Size:15mil (381
um) diameter or non-ink with wafer mapping
Minimum
Sawing street width:3.0 mil (76.2
um)
Wafer
Thickness:Back grinding
is required if the thickness exceeds ASE's stipulated
range
453~1153 mils body sizes
