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Product
Overview |
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| Low profile and thin quad flat packages (QFP) are classified by the overall thickness (t) according to JEDEC definitions: |
L type:
1.2< t <=1.7 mm
T type: 1< t <=1.2 mm |
| Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ASE offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications for memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs. |
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| Exposed Pad L(T)QFP |
| The exposed pad can be soldered to the PCB so that the heat can be driven off directly (the JA is only half as much as the standard L(T)QFP). This pad is also electrically grounded, and thus results in far smaller ground inductance. Exposed pad L(T)QFP is a cost-effective solution, suitable for enhancing thermal and electrical performance. |
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Application |
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| Telecommunication
products |
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Cellular
phones
Wireless LAN |
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| Portable
products |
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Personal
computers
Personal digital assistants
Digital cameras |
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| Medium
lead count packages |
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| Information
appliances |
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| LQFP
/ TQFP |
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| LQFPs are ideal packages for lightweight and portable electronic products requiring broad performance characteristics. The low electrical parasitic out of the small outline and shorter leads makes LQFP suitable for RFICs. Other LQFP applications include lap-top PCs, memory, video ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets, telecom, office equipment, disc drives and communication boards. |
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| EP-LQFP/EP-TQFP |
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Exposed Pad LQFP/TQFP provides better thermal performance, which gives IC designers the needed margin for high performance products. Common applications of Exposed Pad TQFP packages are telecommunication, wireless, disk drives and RF modules. |
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Features |
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| LQFP/EP-LQFP Packing
Offering |
7x7mm to 28x28mm body size available
Wide selection of pad size to meet die requirements
Customized leadframe design capability
32~256 leads counts available
Fine pitch wirebond capability
Pb free process ready and available
High conductivity copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant
MCM/Syack structure designable and available |
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| TQFP/EP-TQFP
Packing Offering |
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10x10mm to 20x20mm body size available
Wide selection of pad size to meet die requirements
Customized leadframe design capability
44~176 leads counts available
Fine pitch wirebond capability
Pb free process ready and available
High conductivity copper leadframes
Low stress die attach materials
Power enhancement version
JEDEC standard compliant |
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Reliability |
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Package
Level |
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Board
Level (Contact ASE R&D for
details.) |
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| Electrical
(Contact ASE R&D for electrical deta.) |
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Design
Rule |
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Minimum
Ink Size:
15mil (381 um) diameter or non-ink
with wafer mapping |
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| Minimum
Sawing street width:
3.0 mil (76.2
um) |
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| Wafer Thickness: The back grinding will be needed if the thickness is out of range of the following ASE standards. |
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| Stack Die for EP-LQFP |
Wafer thickness: 14±1 mils
Minimum distance of die edge between top die and bottom die: 30 mils
Minimum distance from die edge to pad edge : 8 mils (without ground Bond)
Minimum distance from bottom die edge to pad edge: 30 mils (with ground Bond) |
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| Stack Die for EP-TQFP |
Wafer thickness: 9 ±1 mils
Minimum distance of die edge between top die and bottom die: 30 mils
Minimum distance from die edge to pad edge : 8 mils (without ground Bond)
Minimum distance from bottom die edge to pad edge: 30 mils (without ground Bond) |
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Performance |
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Electrical |
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| LQFP |
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| TQFP |
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| (1mm=39.37mil;
1mil=25.4um) |
| The
above electrical data is for reference only. |
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| Thermal
(Contact ASE R&D for details.) |
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| (1mm=39.37mil;
1mil=25.4um) |
| The
above electrical data is for reference only. |
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Standard
Process/Materials |
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| Option process : wafer back grinding/ top side laser marking/ dry packing. |
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Package
Offering |
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| The
alphabetical notation refers to: |
| A1
Stand-off |
| A2
Body thickness |
| L1
Lead length |
| b
Lead width |
| c
L/F thickness |
| e
Lead pitch |
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| Overall
thickness is the sum of A1 and A2. |
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| Packing
& Shipping |
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