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QUAD HQFP
 

Product Overview
 
Heat spreader quad flat pack package (HQFP) uses a composite lead frame to increase heat dissipation. The die pad of HQFP is separate from the leads and enlarged to overlap with part of the leads. The function of this enlarged die pad is similar to the drop-in heat spreader, which is used to increase heat conduction area. HQFP allows about 50% increment in power dissipation compared to conventional QFP.


Application
 

HQFP has higher power dissipation compared to conventional packages. It provides an economical method to upgrade the thermal performance of conventional QFP. HQFP enhances thermal performance compared with conventional packages without change in material and process. HQFP is the IC package of choice for ASICs, DSPs, micro-controllers and memory ICs, PLDs, high speed logic and other related technologies requiring better power management.



Features
 

Real chip size
High-speed data processing
High density interconnection
MCM assembly


Reliability

 



Design Rule
 

(1mm=39.37mil; 1mil=25.4um)



Performance

 
Electrical  
The above electrical data is for reference only.
 
Thermal
 
HQFP  
(1mm=39.37mil; 1mil=25.4um)
The above thermal data is for reference only.



Standard Process/Materials
 
Optional process: wafer back grinding/die coating/top side laser marking/dry packing



Pb Free


Package Offering
 
The alphabetical notation refers to:
A1 Stand-off
A2 Body thickness
L1 Lead length
b Lead width
c L/F thickness
e Lead pitch
 
Overall thickness is the sum of A1 and A2.
 
*All HQFP lead frames are made of copper


Packing & Shipping
 
HQFP



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