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BGA
PBGA
Product
Overview
Plastic ball grid (PBGA) are BGA packages adopting
plastic (epoxy molding compound) as the encapsulation.
According to JEDEC standards, PBGA has an overall
thickness of over 1.7mm.
Application
ASE's
BGA design and features improve the performance
of graphics, PLDs, DSPs, PC chipsets, communications,
networking, microprocessors/controllers, ASIC, gate
arrays and memory packages.
Features
BGA is
suitable for high power and high speed ICs requiring
superb electrical and thermal enhancement.
15x15 mm to 45x45 mm package
119 balls to 1520 ball count
High interconnect density
Low assembly cost
Self-alignment during reflow
Low profile
Ease of thermal and electrical management
Ease of routing
Good power dissipation
JEDEC MS-034 standard outlines
Pb free process available
Full In-house design capability
Reliability
Package
Level
Design
Rule
Description
A
Package size
B Mold cap width/Length
C
Max. finger to finger (Layout)
D Min. distance
from wire to mold cap
E
Max. looping heiqht
F Wafer thickness
G
Package thickness
T Mold cap thickness
Performance
Electrical
Characterization (Contact ASE R&D for details.)
15x15 mm to 45x45 mm package
31X31mm) 
