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BGA PBGA
 

Product Overview

 
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.


Application
 
ASE PBGA's design and features improve the performance of graphics, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages.


Features
 
BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.
15x15 mm to 45x45 mm package
119 balls to 1520 ball count
High interconnect density
Low assembly cost
Self-alignment during reflow
Low profile
Ease of thermal and electrical management
Ease of routing
Good power dissipation
JEDEC MS-034 standard outlines
Lead free process available
Full In-house design capability


Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 500, 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
HTST JEDEC 22-A103-B 150°C, 500/1000 hrs



For more information, please contact ASE sales office.


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