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BGA
HSBGA
Product
Overview
Heat slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance (θJA) of PBGA without a change of material. The θJA of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power, high-speed ICs like graphics, communication, and networking ICs.
Application
HSBGA is an excellent solution for products that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking and graphic ICs, data communications, consumer ICs and telecommunication applications.
Features
15x15 mm to 45x45 mm package available
120 balls to 1520 ball count available
Cost effective
Better electrical performance
Better thermal performance
Good power dissipation
JEDEC MS-034 standard outlines
Lead free process ready and available
Full In-house design capability
Full electrical and thermal characterization capability
Reliability
Design
Rule
Description
A
Package size
B Mold cap width/length
C
H/S explosure area
D Max. finger
to finger (lavout) area
E
H/S thickness
F Distance from
wire to bottom of H/S
G
Max. looping heiqht
H Wafer thickness
T
Package thickness
(1mm=39.37mil;
1mil=25.4um)
Performance
Electrical
HSBGA
The above
electrical data is for reference only.
Thermal
HSBGA (Data
marked with "s" are derived from
simulation.)
15x15 mm to 45x45 mm package available
