ASE Group TOP > Products > Assembly Offerings > BGA > Cavity Down BGA-L2BGA
BGA Cavity Down BGA-L2BGA
 

Product Overview

 
Laser laminate BGA (L2BGA) is one of two types of cavity-down thermally enhanced BGA offered by ASE. Designed with the chip seated onto the copper heat sink to absorb the heat easily, this method desensitizes the performance deviation out of the chip size and lowers the thermal resistance of junction-to-case (θJC), making the external heat sink or fan work more effectively. Cavity-Down BGAs enhance thermal performance with about 15~20% improvement, compared to 4-layer PBGA and with 35% improvement compared with 2-layer PBGA. Electrical performance of Cavity-Down BGA is significant as well. The reason is attributed to their flexible layout for staggered traces on different layers, shorter VIAS and better shielding effect out of the copper heat sink. With the heat sink covering the signal traces fully, Cavitydown BGA provides better resistance to external EMI (Electro-Magnetic Interference) noise.


Application
 
This thermally enhanced package design’s extensive applications include high-speed, highpower semiconductors, such as ASICs, Micro processors, Gate Arrays and DSPs. CS BGA market covers telecom/cellular, laptops/subnotebooks, PDAs, VME CPU/BUS boards, video GUI and wireless. Cavity-Down BGA is an excellent solution for graphic, networking & communication ICs with high-power and high-speed quality performances.


Features
 

 
Superior thermal performance (>6W)
Superior electrical performance
Build-up substrate design with laser VIA for much higher design density solution


Designed substrate with stiffiner to control substrate warpage and to enhance more the thermal dissipation
JEDEC MO-192 / MS-034 standard outlines


Reliability
 



Design Rule
 

Description
A Package size
D Min. distance from ball to mold cap
E Ball height
F Wafer thickness
G Package thickness

 
Definition  
(1mm=39.37mil; 1mil=25.4um)


Performance
 
Electrical Characterization (Contact ASE R&D for details.)
 
L2BGA  
The above electrical data is for reference only.
 
Thermal
 
L2BGA  
The above thermal data is for reference only.



Standard Process/Materials
 
Optional process: Wafer back grinding/ dry packing



Package Offering
 
The alphabetical notation refers to:
A Pkg overall thickness
A1 Stand-off
b Ball diameter
c Substrate thickness
e Ball pitch
A1 in the cavity-down BGA is from the bottom of solder ball to the bottom of encapsulation.
 



Packing & Shipping
 



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