ASE Global

BGA Cavity Down BGA-CSBGA

Product Overview

Cost savings BGA (CSBGA) is one of two types of cavity-down thermally enhanced BGAs offered at ASE. Designed with the chip seated onto the copper heat sink to absorb the heat easily, this method desensitizes the performance deviation out of the chip size, and lowers the thermal resistance of junction-to-case (θJC), making the external heat sink or fan work more effectively. Cavity-down BGAs enhance thermal performance with 15~20% improvement compared with 4-layer PBGA and by 35% compared with 2-layer PBGA. Electrical performance of cavity-down BGA is significant as well. The reason is attributed to it’s flexible layout for staggered traces on different layers, shorter VIAS and better shielding effect out of the copper heat sink. With the heat sink covering the signal traces fully, cavity-down BGA provides better resistance to external EMI (electro- Magnetic Interference) noise.

Application

CSBGA are used extensiuely for ASICs, Micro processors, Gate Arrays and DSPs. CS BGA application include telecom/cellular, laptops/ sub-notebooks, PDAs, VME CPU/BUS boards, video GUI, and wireless.

Cavity-down BGA is an excellent solution for graphic, networking & communication ICs with high-power and high-speed quality performance.

Features

	Superior thermal performance (>6W)
	Superior electrical performance
	Relative low cost with 10-50% cheaper compared with L2BGA
	Laminated substrate design with path through hole VIA for low cost saving solution
	Designes substrate with side wall plating on cavity edge to reduce wire length and increase design density
	JEDEC MO-192/MS-034 standard outlines

Reliability

Thermal

Design Rule

Description

A Package size

D Min. distance from ball to mold cap

E Ball height

F Wafer thickness

G Package thickness

Definition
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(1mm=39.37mil; 1mil=25.4um)

Standard Process/Materials

CSBGA

Optional process: Wafer back grinding/dry packing

Package Offering

The alphabetical notation refers to:

A Pkg overall thickness

A1 Stand-off

b Ball diameter

c Substrate thickness

e Ball pitch

A1 in the cavity-down BGA is from the bottom of solder ball to the bottom of encapsulation.

Packing & Shipping