PBGA
HSBGA
Cavity Down BGA-L2BGA
Cavity Down BGA-CSBGA

Product Overview

Ball-grid arrays (BGA) are IC packages which place output pins in the form of a solder ball matrix. The traces of the BGA are generally fabricated on laminated substrates (BT-based) or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has the advantage of lower ground or power inductance thereby assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA in order to reduce thermal resistance. The higher functional capabilities of the BGA package technology benefit high power and high speed ICs that require enhanced electrical and thermal performance. Compared with traditional SMT packages, the advantages of BGA are as follows:     Higher interconnect density Lower assembly cost Self-alignment during reflow Lower profile Ease of thermal and electrical management Ease of routing

All the BGA packages selected for temperature/ humidity test and temperature cycles are subject to the precondition process per JEDEC moisture LEVEL3 prior to environmental stress. Test criterion is zero defect out of 45 sampling units. Temp/Humidity Test 85°C/ 85% RH, 1000 hr. (JEDEC 22-A101) Pressure Cooker Test 121°C/100% RH/ 15 PSIG, 300 hr./ 168 hr. ( for FC-CSP, SCSP) / 96 hr. ( for FC-BGA) (JEDEC 22-A102) Temp Cyclic Test -65°C~150°C, 1000 cycles/ -55~125°C, 1000 cycles for FC-BGA (MIL-STD-883-1010.7) High Temp Storage Test 150°C, 1000 hr. (JEDEC 22-A103) High Accelerated Stress Test 130°C/85% RH/ 33.5 PSIA, 96 hr. (JEDEC 22-A110)