PGA
 

Product Overview

 
PGA (Pin Grid Array) is a microchip design that has the silicon core of the microchip facing down toward the motherboard. The core is covered by a heat slug, which helps to dissipate the heat to the heatsink better. As IC technology becomes faster, more complex and more powerful, the demands for high-performance packaging increases. The thermal, mechanical and electrical performance of the package should match the requirements of the device. PGA, with its excellent thermal, mechanical, and electrical performance, easily meets high performance requirements.


Application
 
Suitable for highly demanding, high-performance microprocessors.


Features

 

 

Excellent thermal performance
Excellent electrical performance
High mechanical strength
Excellent high frequency insulation
No water absorption


Reliability

 



Performance

 
Electrical  
The above electrical data is for reference only.
 
Thermal  
The above thermal data is for reference only.



Standard Process/Materials

 



Package Offering

 
 
D1,E1 Pkg size
A Pkg overall thickness
A1 Stand-off
b Pin diameter
c Heat sink tickness
e Pin pitch
 



Packing & Shipping