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Product
Overview
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| PGA (Pin Grid Array) is a microchip design that has the silicon core of the microchip facing down toward the motherboard. The core is covered by a heat slug, which helps to dissipate the heat to the heatsink better. As IC technology becomes faster, more complex and more powerful, the demands for high-performance packaging increases. The thermal, mechanical and electrical performance of the package should match the requirements of the device. PGA, with its excellent thermal, mechanical, and electrical performance, easily meets high performance requirements. |
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| Application |
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| Suitable for highly demanding, high-performance microprocessors. |
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Features
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Excellent thermal performance
Excellent electrical performance
High mechanical strength
Excellent high frequency insulation
No water absorption |
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Reliability
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Performance
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| Electrical |
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| The above
electrical data is for reference only. |
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| Thermal |
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| The above
thermal data is for reference only. |
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Standard
Process/Materials
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Package
Offering
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| D1,E1
Pkg size |
| A Pkg overall thickness |
| A1
Stand-off |
| b Pin diameter |
| c
Heat sink tickness |
| e Pin
pitch |
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| Packing
& Shipping |
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