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CSPLow & Thin-LFBGA
Product
Overview
Low &
Thin BGA is an ideal solution to meet requirements
of both dense layout and small outline for ICs of
I/O counts of less than 288. Four-layer BT substrates
are available for these packages to provide better
electrical characteristics. Low & Thin BGA was
developed for space reduction. This type of package
is a chip size solution based on mature laminated
substrate technology and material.
Application
Low &
Thin BGAs are suitable for high-performance ICs
like flash, SRAM, DSP memory, communication ICs
and RFICs. Common applications of Low & Thin
BGA are computer and communication products,
such as PDA, notebooks and memory cards, cell phones,
mobile stations and wireless systems.
Features
Maximum package size: 19x19 mm
0.5 mm ball pitches available
JEDEC level 2A reliability
Fine pitch technology development
MCM package available
Pb free package available
Reliability
Package
Level
Design
Rule
Package
size (A)
19x19
mm Max.
Finger edge to substrate edge
100
um Min.
Max
wire length (C)
140
mils (3556 um) Max.
Wire diameter (D)
1.0
mil
Die
edge to finger edge (E)
17
mils (431 um) Min.
Saw
street (F)
0.3
mm
(1mm=39.37mil;
1mil=25.4um)
Performance
Electrical
L(F)BGA
The above
electrical data is for reference only.
Thermal
L(F)BGA
The above
thermal data is for reference only.
Standard
Process/Materials
L(F)BGA
Process Stage
Wafer Grinding
Wafer Mount
Wafer Saq/Clean
2nd Optical (Gate)
Die Attcch
Epoxy Cure
Plasma Clean
Wire Bond
3rd Optical (Gate)
Plasma Clean
Mold
Top Side Marking
Post Mold Cure
Colder Ball Mount
Flux Clean
Substrate Sawing (Singulation)
Final Visual Inspection (Gate)
Packing
Package
Offering
D1, E1 Pkg size
A Pkg overall thickness
A1 Stand-off
b Ball diameter
c Substrate thickness
e Ball
pitch
Package
sizes vary by customer request and substrate design.
BGA-fea.gif)
Maximum package size: 19x19 mmBGA-des.gif)
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