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CSPLeadless-QFN
Product
Overview
QFN
Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.
Application
Telecommunication
products
Cellular phones
Wireless LAN
Portable
products
Personal digital assistants
Digital cameras
Low
to medium lead count packages
Information appliances
Features
Small footprint
Low profile (< 0.9 0.2 L/F + 0.65 Mold)
Light weight
Cost effective
Better electrical performance
Better power dissipation
Reliability
Package Level
MSL
JEDEC 22-A113
JEDEC Level 2Aa 60°C/60%120 hours for PPF lead frame
JDEEC Level 2Aa 60°C/60%120 hours for Cu lead frame
