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CSPLow & Thin-TFBGA
Product
Overview
TFBGA
is an ideal solution to the requirements of both
dense layout and small outline for ICs of I/O counts
of less than 329. Four-layer BT substrates are available
for these packages to provide better electrical
characteristics. TFBGA technology was developed
for space reduction. This type of package has chip
size solution based on mature laminated substrate
technology and material.
Application
TFBGA
are suitable for high-performance ICs like flash,
SRAM, DSP Memory, Communi-cation ICs and RFICs.
Common applications are computing and communication
products such as PDA, notebooks, memory cards, cell
phones, mobile stations and wireless systems
Features
Maximum package size: 18x18 mm
Minimum package size: 6x6 mm
0.5 mm ball pitches available
JEDEC level 2A reliability
Memory assembly available
MCM package available
Pb free package available
Reliability
Design
Rule
Package
size (A)
18x18
mm Max.
Finger edge to substrate edge
100
um Min.
Max
wire length (C)
140
mils (3810 um) Max.
Wire diameter (D)
1.0
mil
Die
edge to finger edge (E)
17
mils (431 um) Min.
Saw
street (F)
0.3
mm
(1mm=39.37mil;
1mil=25.4um)
Performance
Electrical
T(F)BGA
Ball count
Pkg
size (mm)
47
7x10
48
6x9
48
7x7
48
8x9
64
13x10
64
10x13
200
13x13
The above
electrical data is for reference only.
Thermal
T(F)BGA
Ball count
Pkg
size (mm)
36
6x8
40
8x15
48
6x8
48
6.15x8.15
48
6x9
48
7x7
48
7x7
48
8x9
48
8x9
48
8x10
48
8x10
48
7x12
48
8x13
64
8x8
64
8x8
64
13x10
63
11x12
100
10x10
208
13x13
324
18x18
(1mm=39.37mil;
1mil=25.4um)
The above
thermal data is for reference only.
Standard
Process/Materials
T(F)BGA
Process Stage
Wafer Grinding
Wafer Mount
Wafer Saw/Clean
2nd Optical (Gate)
Die Attach
Epoxy Cure
Plasma Clean
Wire Bond
3rd Optical (Gate)
Plasma Clean
Mold
Top Side Marking
Post Mold Cure
Solder Ball Mount
Flux Clean
Substrate Sawing (Singulation)
Final Visual Inspection (Gate)
Packing
Package
Offering
A Pkg overall thickness
A1 Stand-off
b Ball diameter
c Substrate thickness
e Ball pitch
D1 Pkg
size
E1
Pkg size
Package
sizes vary by customer request and substrate design.
Maximum package size: 18x18 mm
