ASE Global

CSP Leadless-LGA

Product Overview

Land grid array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantage over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5 mm) and lighter CSP. LGA technology has been developed for lead free solution and spacing reduction on mother boards. This type of package has chip size solution based on mature laminated substrate technology and material.

Application

LGA is suitable for high performance ICs like Single Chip, CPU, Logic and Memory. Common applications for this type of package includes:

Telecommunication products
Cellular phone-RF Devices
Wireless LAN

Portable products
Personal digital assistants
Digital camera
IC recorders
MP3 players

Memory card
SD card
MS card
PCMCIA
Compact

Features

Thinner, lighter and smaller Chip-Scale Package

Mature standard matrix BGA assembly process

Higher yield/quality

Higher though-put

Lower cost

Space reduction in system level

Pb free solution

Excellent electrical and thermal performance

Reliability

Test Item	Reference Standard	Condition/Duration
MSL	JEDEC22-A103	Level 3, 30°C/60% RH, 192 hrs
TCT	JEDEC 22-A104-B	-65°C to 150°C, 1000 cycles
HAST	JEDEC 22-A118	130°C/85% RH, 33.5 psi 96 hrs
HTST	JEDEC 22-A103-B	150°C, 1000 hrs

For more information, please contact ASE sales office.