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CSPLow & Thin-VFBGA
Product
Overview
The total thickness
of the package Very Fine Pitch (VFBGA) BGA can be
as little as 1.0 mm, due to significant improvement
in substrate and die thinning technology.
Key benefits:
* Small, thin and
light
* Low cost and High
volume production solution
* Competitive reliability
performance (MSL 2)
Application
VFBGA is commonly
used in cellular phones, hard disk drives, PLD's
and digital cameras. Increasing demand for thin packages
with high density performance make VFBGA a highly competitive and reliable package solution to meet this demand. This package is highly
recommended for DRAM, SRAM, Flash, EEPROM, ASIC,
PLD & analog products.
Features
3.9x3.9 mm to 15x15 mm body size available
5~400 I/O
0.5/0.65/0.75/0.8 mm in ball pitch
Rigid & customized routing substrate design
High density interconnection
Full in-house design capability
Fine Pitch wirebond capability
Low assembly cost
Self-alignment during re-flow
High speed performance
Lower profile (Package thickness)
Pb Free & Green Package process ready and available
Ease of thermal and electrical management
Ease of routing
JEDEC standard criteria
Reliability
The VFBGA package
have passed MSL2@240°C MSL 3@260°C (Pb Free and
Green requirement.)
MSL2@240°C
MSL3@260°C
Package
Structure
Thickness
(Total)
1.0
mm Max
Mold cap thickness (A)
0.45
mm
Substrate thickness (B)
0.21
mm
Solder ball height (C)
0.27
mm
Wafer
thickness (D)
6
mils
Epoxy (E)
1.5
mils (Max.)
Loop height (F)
5.5
mils (Max.)
Design
Rule
Item
Description
Criteria
(um)
G-A
Exposed
bond finger metal (Double bond)
406
min.
G-B
Exposed
bond finger metal (Single bond)
280
min.
G-C
Max.
bond wire length
5000
um (200 mils) Max.
G-D
Bond
wire center to adjacent bond pad center
50
min.
G-E
Die
bond pad pitch
60
min.
G-F
Bond
wire span over bond finger before target
point
90
min.
G-G
Lead
length in line with bond wire beyond target
point
45
min.
G-H
Bond
wire center to adjacent bond finger (Bottom
die only)
3.9x3.9 mm to 15x15 mm body size available 
