|
Product
Overview |
| |
| BCC (bump chip carrier) uses plating metal pads (so called “terminals”, as small as 0.4x0.3mm) to connect with the PCB. The terminals, which are etched from copper-based lead frame during the packaging process, can be placed on the periphery of the package with in-line or staggered layout. BCC+ and BCC++ both have exposed die pads, which can be soldered to the PCB. This direct heat path enhances the thermal performance. BCC++ further intensifies and enhances the electrical performance by allocating a ground ring, which is extended from the die pad, to allow wire bonding. This common ground can reduce the ground inductance and curb the in ductive noise. The BCC packages are suitable for applications of over 12GHz working frequency. |
|
| Application |
| |
| The BCC series package is very suitable for small size and light weight packages that requires excellent electrical and thermal performance. Any application requiring high frequency and high power package performance, light weight, and small package size can choose BCC package, especially for telecommunications (wireless applications like cellular phones, handsets, PDAs, wireless cards, base station and wireless LAN), portable products (like personal digital assistants and digital camera) and low to medium lead count packages (for information appliances application).The BCC series package is very suitable for small size and light weight packages that requires excellent electrical and thermal performance. Any application requiring high frequency and high power package performance, light weight, and small package size can choose BCC package, especially for telecommunications (wireless applications like cellular phones, handsets, PDAs, wireless cards, base station and wireless LAN), portable products (like personal digital assistants and digital camera) and low to medium lead count packages (for information appliances application). |
|
|
Features |
| |
 |
|
|
Small package size, light weight
Package height 0.8mm max
Excellent thermal performance
Excellent electrical performance
Suitable for high frequency application
Custom-design available |
|
|
Reliability |
| |
|
| MSL for
BCC+ is the same as BCC++ |
| |
|
| Board
level is the same as BCC++ |
|
| Design
Rule |
| Single row |
| Pkg
size (mm) |
Max
die space (mm) |
| BCC |
BCC+ |
BCC++ |
| 3X3 |
1.4x1.4 |
0.7x0.7 |
0.5x0.5 |
| 4X4 |
2.4x2.4 |
1.7x1.7 |
1.5x1.5 |
| 5X5 |
3.4x3.4 |
2.7x2.7 |
2.5x2.5 |
| 6X6 |
4.4x4.4 |
3.7x3.7 |
3.5x3.5 |
| 7X7 |
5.4x5.4 |
4.7x4.7 |
4.5x4.5 |
| 8X8 |
6.4x6.4 |
5.7x5.7 |
5.5x5.5 |
| 9X9 |
7.4x7.4 |
6.7x6.7 |
6.5x6.5 |
(1mm=39.37mil; 1mil= 25.4um)
| Stagger row |
| Pkg
size (mm) |
Max
die space (mm) |
| BCC |
BCC+ |
BCC++ |
| 7x7 |
3.6x3.6 |
3.5x3.5 |
3.3x3.3 |
| 8x8 |
4.6x4.6 |
4.5x4.51 |
4.3x4.3 |
| 9x9 |
5.6x5.6 |
5.5x5.5 |
5.3x5.3 |
| 10x10 |
6.6x6.6 |
6.5x6.5 |
6.3x6.3 |
| 11x11 |
7.6x7.6 |
7.5x7.5 |
7.3x7.3 |
| 12x12 |
8.6x8.6 |
8.5x8.5 |
8.3x8.3 |
|
|
|
|
Performance |
| |
| Electrical
|
| |
| The electrical data about leadless packages is variable. Two components, the bond wire and terminal can effect the electrical parasitic. Apparently, the effect from the terminal is trivial. Therefore, the electrical parasitic (mostly from the inductance) can be simply estimated by calculating the wire length. The empirical RLC values for gold wire with 25um diameter are 50 mΩ/mm, 1 nH/mm, and 0.06 pF/mm. |
| |
| Thermal |
| |
| For BCC+
and BCC++, the exposed die pad has to be soldered
to PCB to maintain its thermal performance. Little
improvement is found if the pad is floating. Contact
ASE R&D for thermal data. |
| |
| BCC |
|
 |
|
|
| |
| BCC++ |
|
 |
|
|
| The
above thermal data is for reference only. |
|
|
| Standard
Process/Materials |
| |
|
|
|
Packing
& Shipping |
| |
| Tray is standard package
offering. Material and tube are optional. |
| |
|
| |
|
|
|
| Package
Offering |
| |
 |
| |
|
 |
| |
|
|
