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CSP Leadless-aQFN™
 

Product Overview

 
Advanced Quad Flat No-lead. aQFN™ is solution for Lead less, multi-row and fine pitch lead frame package with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process.


Application
 
Telecommunication products
Cellular phones
Wireless LAN

Portable products
Personal digital assistants
Digital cameras

Low to medium lead count packages
Information appliances


Features
 
Low profile, small footprint and light weight
Free-form I/O design
Fine lead pitch 0.4mm
Excellent thermal performance
Excellent electrical performance
Good SMT performance
Cost effective package
Extend QFN I/O count up to 400


Reliability
 
Package Level
MSL JEDEC Level 3, 30°C/ 60% RH 192 hours
PCT 121°C/ 100% RH/ 2 atm 168 hours
TCT –65°C ~ 150°C 1000 cycles
HAST 130°C/ 85% RH/33.5 PSIG 96 hours
HTST 150°C 1000 cycles
 
Board Level

TCT

0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively

1000 cycles

Drop Test

JEDEC standard

30 drops Min



For more information, please contact ASE sales office.


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