| First dielectric layer coating/ exposure/ developing |
| Runner sputter deposition |
| Runner photolithography |
| Runner metal etch |
| Second dielectric layer coating/ exposure/ developing |
| UBM Sputter deposition |
| UBM photolithography |
| USB metal etch |
| Wafer grinding (Optional) |
| Wafer laser marking (Optional) |
| Wafer ball mounting/ Polymer Collar (Optional) |
| Wafer testing |
| Wafer sawing |
| 2D Inspection (100%) |
| Die Sorting (Tape & Reel; Waffle Pack) |
| Final Inspection |
| Packing |