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SIPMCM BGA
Product
Overview
The need for high density, high performance, and cost effectiveness sped up the development and application of the multi-chip module (MCM). This type of package allows integration of different chip functions onto mini-substrates instead of inserting individual packages onto a large PCB (or so-called second level package).
ASE's Multi-Chip Module Ball Grid Array (MCM BGA) assembly employs the latest IC packaging technology for high-density products. The electrical, and thermal performance, and the cost effectiveness of the MCM BGA package enables system designers to integrate several devices onto a single IC package.
Application
The integration of several semiconductor technologies onto a MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance, and board density are required. The high-speed performance and improved thermal capability of the MCM BGA package are excellent for personal computing, networking and graphic IC, data communication, consumer IC, telecommunication, analog/digital, bipolar/CMOS, ASIC, and memory applications.
Features
23x23 mm to 45x45 mm body size
Full in-house design capability
Fine Pitch wirebond capability
Lead free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant
Reliability
Package
Level
Design
Rule
(1mm=39.37mil;
1mil=25.4um)
Remark 1: * ASE standard rule for gold wire dia. and wire length.
Remark 2: PBGA design rule for die thickness.
Performance
Electrical
Characterization (Contact ASE R&D
for details.)
Thermal
Characterization (Refer to PBGA.)
Standard
Process/Materials
Wafer Mount
Wafer Saw/Clean
2nd Optical (Gate)
Die Attach
Epoxy Cure
Plasma Clean
Wire Bond
3rd Optical (Gate)
Plasma Clean
Mold
Top Side Marking
Post Mold Cure
Solder Ball Mount
Flux Clean
Singulation
Final Visual Inspection (Gate)
Packing
Package
Offering
The
alphabetical notation refers to: (All
units are in mm.)
23x23 mm to 45x45 mm body size
