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SIPStacked BGA
Product
Overview
ASE offers stacked chip scale package (SCSP) and stacked quad flat package (SQFP) that combines BGA and leadframe package solutions onto each MCM type. Stacked CSP is the most popular package solution for flash & SRAM combination.
Another exclusive stacked die package offered by ASE is the Sandwich SCSP. This unique package combines up to 4 dies stacked on top of another with one of the die acting as a spacer in between. For more information on how Sandwich SCSP can solve your packaging problems, contact ASE R&D.
Application
The integration of several semiconductor technologies into a single MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance, and board density are important considerations.
Stacked CSP/QFP is suitable for chip applications in cellular phones, PDAs and various handheld electronics. Sandwich SCSP is suitable for applications in memory cards and also handheld electronics.
Features
23x23 mm to 45x45 mm body size available
Full in-house design capability
Fine Pitch wirebond capability
Pb free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant
Reliability
Package
Level
Design
Rule
(1mm=39.37mil;
1mil=25.4um)
Remark:
1. If "D" was less than 12 mils, the sandwich
package design rule is applicable. 2.
Side by side MCM BGA rule is applicable. 3.
ASE standard rule for gold wire dia and wire length.
(1mm=39.37mil;
1mil=25.4um)
Remark:
1. ASE standard rule for gold wire dia. and wire
length.
D3 Upper function
die
E3 Non-conductive epoxy layer
(QMI536)
D2 Middle3
Dummy Die
E2 Non-conductive epoxy (QMI536)
layer
D1 Bottom function
die
E1 Conductive epoxy
(2100A) layer
H Wire loop height
T Mold cap thickness
Performance
Electrical
Characterization (Contact ASE R&D
for details.)
Thermal
Characterization (Refer to PBGA.)
Standard
Process/Materials
Wafer Mount
Wafer Saw/Clean
2nd Optical (Gate)
Die Attach
Die Attach Cure
Plasma Clean
Wire Bond
3rd Optical (Gate)
Plasma Clean
Mold
Top Side Marking
Post Mold Cure
Solder Ball Mount
Flux Clean
Singulation
Final Visual Inspection (Gate)
Packing
Package
Offering
The
alphabetical notation means: (All units
are in mm.)
23x23 mm to 45x45 mm body size available
