ASE Group TOP > Products > Assembly Offerings > SiP > Side by Side BGA
SiP Side by Side BGA
 

Product Overview

 
Side by side MCM PBGA and side by side MCM HSBGA are the types of MCMs offered by ASE. MCM HSBGA includes multi heat slug for heat dissipation in different die layout (square, trapezoid and eclipse).


Application
 
PC
Chipset
Graphics and Memory

Consumer
Game console
Set top box

Communication
PDA
Bluetooth modules


Features

 
23x23 mm to 45x45 mm body size
Full in-house design capability
Fine Pitch wirebond capability
Lead free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant


Reliability
 
Package Level
MSL JEDEC Level 3, 30°C/ 60% RH 192 hours
PCT 121°C/ 100% RH/ 2 atm 168 hours
TCT –65°C ~ 150°C 1000 cycles
HAST 130°C/ 85% RH 96 hours
HTST 150°C 1000 cycles
 
Board Level
TCT -40°C~125°C 3500 cycles no failure
THT 85°C/85% RH 1000 hours no failed
Vibration test 4 times of vibration for eash axis No failed



For more information, please contact ASE sales office.


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