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SIPSide by Side BGA
Product
Overview
Side by
side MCM PBGA and side by side MCM HSBGA are the
types of MCMs offered by ASE. MCM HSBGA includes
multi heat slug for heat dissipation in different
die layout (square, trapezoid and eclipse).
Application
PC:
Chipset, Graphics
and Memory
Consumer:
Game console, Set
top box
Communication:
PDA, Bluetooth modules
Features
23x23 mm to 45x45 mm body size
Full in-house design capability
Fine Pitch wirebond capability
Lead free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant
Reliability
Package
Level
Design
Rule
(1mm=39.37mil;
1mil=25.4um)
Remark
1: ASE standard rule for gold wire dia. and wire
length
Remark
2: PBGA design rule for die thickness
Performance
Electrical
Characterization (Contact ASE R&D
for details.)
Thermal
Characterization (Refer to PBGA.)
Standard
Process/Materials
Wafer Mount
Wafer Saw/Clean
2nd Optical (Gate)
Die Attach
Die Attach Cure
Plasma Clean
Wire Bond
3rd Optical (Gate)
Plasma Clean
Mold
Top Side Marking
Post Mold Cure
Solder Ball Mount
Flux Clean
Singulation
Final Visual Inspection (Gate)
Packing
Optional process: Wafer back grinding/ dry packing.
23x23 mm to 45x45 mm body size 
