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SiP Stacked PBGA
 

Product Overview

 
ASE offers stacked Ball Grid Allay package that combines BGA package solutions onto MCM type. Stacked BGAs are also one of the most SiP popular package solutions for flash & SRAM combination.

For more information on how SiP Stacked BGA can solve your packaging problems. Contact your local ASE office for further information.


Application
 
The integration of several semiconductor technologies into single MCM BGA package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations.


Features

 
23x23 mm to 45x45 mm body size available
Full in-house design capability
Fine Pitch wirebond capability
Pb free process available
High speed performance
Good thermal performance
Different devices integrated onto one package
Cost effective solution for high density package
Eliminate the use of second level package
Good electrical performance
JEDEC standard compliant


Reliability
 
Package Level
Test Item Reference Standard Condition/Duration
MSL JEDEC 22-A103 Level 3, 30°C/60% RH, 192 hrs
TCT JEDEC 22-A104-B -65°C to 150°C, 1000 cycles
HAST JEDEC 22-A118 130°C/85% RH, 33.5 psi 96 hrs
HTST JEDEC 22-A103-B 150°C, 1000 hrs



For more information, please contact ASE sales office.


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