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SiPStacked CSP
Product
Overview
ASE offer Stacked Chip Scale Package (SCSP) that combines BGA and Leadframe package solutions onto each MCM type.
Another exclusive stacked die package offered by ASE is the Sandwich SCSP. This unique package combines up to 5 dice stacked on top of another with one of the dice acting as a spacer in between. For more information on how Sandwich SCSP can solve your packaging problems, contact your local ASE office for further information.
Application
The integration of several semiconductor technologies into single package offers excellent advantages for many applications where size, weight, electrical performance and board density are important considerations.
Stacked CSP is suitable for chip applications in cellular phones, PDA and various handheld electronics. Sandwich SCSP is suitable for applications in high density memory structure and also handheld electronics.
Features
5x5 mm to 19x19 mm body size available
Different function integrated into package level
Full in-house flexible design capability
High speed and good electrical performance
RoSH / Green process available
Cost saving and time to market solution for multi-function package
