ASE Global

SiP Hybrid (Flip Chip + Wire Bond)

Product Overview

Hybrid (F/C + W/B) is a package technology stacking one die on the top of probed good die to integrate an ASIC and memories such as flash, SRAM and DDR into one package, interconnecting them with wire bonding and molding. Hybrid packages deliver increased functionality and performance. Besides, they offer procurement flexibility, lowest packaging cost compared to individually package die and faster time to market. Normally designers use Hybrid package for wireless applications such as cell phones and consumer products like camcorders, digital camera and PDA etc.

Currently, the major concern to the packaging is KGD issue (Known good die). One bad die will ruin the entire module. Also, the rework is not an option. Therefore, probed good die is important before integration.

Application

Applications of Hybrid package include analog devices, ASIC, Baseband, Processor, integrated passives, and RF devices.

Consumers
Camcorders
Digital Camera
Digital Home
DVD

Communication
Smart phone
Blue tooth
PDA

Compute
WiMAX
WLAN
Notebook

Car
GPS
Automotive

Features

Package size 7x7 mm to 14x14mm available

Fine Pitch wire bond capability

Green process available

Smaller, Thinner and Lighter Packages

Cost effective solution for high density package

Higher performance structure for molding type

Easy rework or change on board level process

Stacked die solution

JEDEC standard compliant

For more information, please contact ASE sales office.