ASE Global

SiP

MCM BGA
Stacked BGA
Stacked CSP
Side by Side BGA
3D Package

Product Overview

Demand for semiconductor miniaturization and increased functionality have brought system in package (SiP) technology to the forefront of semiconductor developments. SiP performs a sub-system function at the package level, and is much more than just a multiple chip package, dies laid out side by side or stacked inside of an encapsulant. SiP has now evolved into integrated modules of several chip packages lined up side by side or stacked, or adding passives or other required components into the package to build a full sub-system function.

There are two major SiP package family groups offered at ASE - die combination and package combination. Die combination packages include MCM BGA and Stacked Die Package (SCSP). Package combinations include Multi Package BGA (MPBGA) and Stacked Package BGA (SPBGA).

MCM BGA

This is a typical SiP product. Combining several devices into one package can significantly improve electrical performance by shortening the communication path between the devices, and reducing system level size by performing subsystem function from the PCB board to the package. ASE's MCM BGA offers the punch type outline similar to a conventional PBGA, and the sawing type outline, similar to the CSP format of the LFBGA. A thermal enhancement solution, Heat Slug BGA (HSBGA), provides for higher thermal dissipation requirements by integrating several high power chips into the package.

Multi Package BGA (MPBGA)

MPBGA is an innovative SiP solution that integrates the related functional components to perform a system function at the package level. It consists of Known Good Die (KGD) and utilizes advanced substrate technology and Surface Mount Technology to enable flexibility in design and efficiency in production. Two package types are available, wire bond and flip chip. A heat spreader attachment is available as an option to handle thermal dissipation.

Stacked Package BGA (SPBGA)

Stacked Package BGA is another KGD package solution within ASE's SiP family that solves space limitations. SPBGA adopts the 3D idea, by stacking the related functional packages as a tower structure. Each package is individually assembled and functionally tested for each segment, then finally assembled through a surface mount process.