Flip Chip Flip Chip CSP
 

Product Overview

 
FC-CSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os of around 200 or less. FC-CSP provides better protection for the chip and better solder joint reliability compared to direct chip attach (DCA) or chip on board (COB).FC-CSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FC-CSP features thin and small profile, and lightweight packages.

Chip typer include RFICs and memory ICs. ASE provides packaging services for any customerdesigned size at ball pitches ranging from 0.5 to 1.0mm, and no. of I/Os from 16 to 200. The types of encapsulation are underfill and overmold.


Application
 
Consumer:
Camcorder, Digital Camera, DVD, etc.
 
Computer:
Voltage regulators, High-Speed Memory, Card PC, Peripherals, etc.
 
Telecommunication:
Pagers, Cellular handsets, etc.


Features

  • Thinner Profile
    "Wafer Thinning" capability (down to 8 mils) to support packages thinner than 1.0 mm package.
  • Substrate
    2-layer BT laminate substrate is used to reduce overall package cost.
  • Improved Performance
    Thin core (100 um) substrate & via-on-pad design can be adopted to achieve better electrical performance.
  • Robust Structure
    Overmolded process can enhance throughput, component and board level reliability.


Reliability

 
 
Board Level
 
 
Weibull distribution of FC-CSP 48L with different surface finish and 0.30 mm dia. Sn 63/Pb 37 solder ball. Test Condition: -40°C~125°C air-to-air.



Design Rule

 
Packaging Capability/Outline Dimension (All units are in mm.)
 
The alphabetical notation means:
A Pkg Overall thickness
A1 Stand-off
b Ball diameter
c Substrate thickness
e Ball pitch
 
(1mm=39.37mil; 1mil=25.4um)
* Depended on the die and substrate thickness



Performance

 
Electrical (Contact ASE R&D for details.)
 
Thermal
 
The thermal data of flip chip packages is related to several factors; number of substrate layers, substrate thickness, substrate material, die size, and I/O pad layout. (Contact ASE R&D for details.)



Standard Process/Materials

 
Optional process: Dry packing/molding/heat spreader planting (for FC-BGA)



Package Offering

 
*MFC BGA: Molded only Flip Chip BGA



Packing & Shipping
 
Tube or tray or other materials