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Product
Overview
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FC-CSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os of around 200 or less. FC-CSP provides better protection for the chip and better solder joint reliability compared to direct chip attach (DCA) or chip on board (COB).FC-CSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FC-CSP features thin and small profile, and lightweight packages.
Chip typer include RFICs and memory ICs. ASE provides packaging services for any customerdesigned size at ball pitches ranging from 0.5 to 1.0mm, and no. of I/Os from 16 to 200. The types of encapsulation are underfill and overmold. |
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| Application |
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| Consumer:
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| Camcorder,
Digital Camera, DVD, etc. |
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| Computer:
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| Voltage regulators,
High-Speed Memory, Card PC, Peripherals, etc. |
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| Telecommunication:
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| Pagers, Cellular handsets,
etc. |
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Features
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- Thinner
Profile
"Wafer
Thinning" capability (down to 8 mils) to
support packages thinner than 1.0 mm package.
- Substrate
2-layer
BT laminate substrate is used to reduce overall
package cost.
- Improved
Performance
Thin
core (100 um) substrate & via-on-pad design
can be adopted to achieve better electrical performance.
- Robust
Structure
Overmolded
process can enhance throughput, component and
board level reliability.
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Reliability
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| Board
Level |
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| Weibull
distribution of FC-CSP 48L with different surface
finish and 0.30 mm dia. Sn 63/Pb 37 solder ball.
Test Condition: -40°C~125°C air-to-air. |
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Design
Rule
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| Packaging
Capability/Outline Dimension (All
units are in mm.) |
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| The
alphabetical notation means: |
| A
Pkg Overall thickness |
| A1
Stand-off |
| b
Ball diameter |
| c
Substrate thickness |
| e
Ball pitch |
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| (1mm=39.37mil; 1mil=25.4um) |
| *
Depended on the die and substrate thickness |
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Performance
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| Electrical
(Contact ASE R&D for details.) |
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| Thermal
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| The thermal
data of flip chip packages is related to several
factors; number of substrate layers, substrate thickness,
substrate material, die size, and I/O pad layout.
(Contact ASE R&D for details.) |
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Standard
Process/Materials
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| Optional
process: Dry packing/molding/heat spreader planting
(for FC-BGA) |
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Package
Offering
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| *MFC
BGA: Molded only Flip Chip BGA |
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| Packing
& Shipping |
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| Tube
or tray or other materials |
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