Flip Chip Flip Chip BGA
 

Product Overview

 
Flip Chip Organic BGA
 
Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA packages especially in high frequency applications.
 
Flip Chip Ceramic BGA
 
Alumina ceramic substrate offers better moisture resistance, electrical insulating property coefficient of thermal expansion ( CTE ), and higher thermal conductivity than organic substrate. FCCBGA is used primarily for high-reliability commercial applications (e.g. CPU).


Application
 
Computer:
Graphics/chipsets for PCs, Server and High-end application, Microprocessors for PC & Servers, Memory.
 
Telecommunications:
Network products (LAN), Switching, Transmission, Cellular Base Stations.


Features

 

Substrate:
4 layer laminate, 4~8 layer build-up, and ceramic substrates are available for different applications.
Passive Component:
Passive component attaching is available. It can be placed on the top or bottom side of the package.
Ceramic BGA:
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages.


Reliability

 
Package Level
 
 
Board Level(Contact ASE R&D for details.)



Design Rule

 
Packaging Capability/Outline Dimension (All units are in mm.)
 
The alphabetical notation refers to:
A Pkg Overall thickness
A1 Stand-off
b Ball diameter
c Substrate thickness
e Ball pitch
 
(1mm=39.37mil; 1mil=25.4um)
 



Performance

 
Electrical (Contact ASE R&D for details.)
 
Thermal
 
The thermal data of flip chip packages is related to several factors, number of substrate layers, substrate thickness, substrate material, die size, and I/O pad layout.
 
*HFC BGA: High performance Flip Chip BGA (with Heat Spreader).



Standard Process/Materials

 
Optional process: Dry packing/molding/heat spreader planting (for FC-BGA)



Package Offering

 
Notes:1. Ceramic type flip chip package is offered in BGA and PGA in the connection of output.
2. HiTCE FC CBGA (High co-efficient of thermal expansion, flip chip ceramic BGA) is flip chip package with HiTCE ceramic substrate.
3. MFC BGA (molded flip chip BGA) is flip chip package with additional overmold encapsulation on the package.
4. TFC BGA is a die down type of flip chip package with heat spreader.



Packing & Shipping