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Product
Overview |
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| Flip
Chip Organic BGA |
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| Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA packages especially in high frequency applications. |
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| Flip
Chip Ceramic BGA |
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| Alumina ceramic substrate offers better moisture resistance, electrical insulating property coefficient of thermal expansion ( CTE ), and higher thermal conductivity than organic substrate. FCCBGA is used primarily for high-reliability commercial applications (e.g. CPU). |
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| Application |
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| Computer:
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| Graphics/chipsets for PCs, Server and High-end application, Microprocessors for PC & Servers, Memory. |
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| Telecommunications:
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| Network products (LAN), Switching, Transmission, Cellular Base Stations. |
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Features |
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Substrate:
4 layer laminate, 4~8 layer build-up, and ceramic substrates are available for different applications.
Passive Component:
Passive
component attaching is available. It can be placed
on the top or bottom side of the
package.
Ceramic BGA:
High
Pb solder ball with eutectic solder paste improves
board level reliability performance
of ceramic packages. |
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Reliability |
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| Package
Level |
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| Board
Level(Contact ASE R&D for details.) |
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Design
Rule |
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| Packaging
Capability/Outline Dimension (All
units are in mm.) |
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| The alphabetical notation refers to: |
| A
Pkg Overall thickness |
| A1
Stand-off |
| b
Ball diameter |
| c
Substrate thickness |
| e
Ball pitch |
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| (1mm=39.37mil;
1mil=25.4um) |
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Performance |
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| Electrical
(Contact ASE R&D for details.) |
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| Thermal
|
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| The thermal
data of flip chip packages is related to several
factors, number of substrate layers, substrate thickness,
substrate material, die size, and I/O pad layout. |
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| *HFC
BGA: High performance Flip Chip BGA (with Heat Spreader). |
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Standard
Process/Materials |
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| Optional
process: Dry packing/molding/heat spreader planting (for FC-BGA) |
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Package
Offering |
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| Notes:1.
Ceramic type flip chip package is offered in BGA
and PGA in the connection of output. |
| 2.
HiTCE FC CBGA (High co-efficient of thermal expansion,
flip chip ceramic BGA) is flip
chip package with HiTCE ceramic substrate. |
| 3.
MFC BGA (molded flip chip BGA) is flip chip package
with additional overmold encapsulation
on the package. |
| 4.
TFC BGA is a die down type of flip chip package
with heat spreader. |
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| Packing
& Shipping |
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