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Flip
Chip Flip Chip BGA (FCBGA)
Product
Overview
Flip Chip Organic BGA
Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.
Flip Chip Ceramic BGA
Alumina ceramic substrate offers better moisture resistance, electrical insulating property and higher thermal conductivity than organic substrate. FCBGA is used primarily for high-reliability commercial applications (e.g. CPU).
Application
Computer
Graphics/chipsets for PC
Server
Game console and High-end application
Microprocessor for PC & Server
memory
Telecommunications
Network products (LAN)
Switching
Transmission
Cellular Base Stations
Features
Substrate
4 layer laminate, 4~12 layer & 800 / 400 um Build-up substrates, and ceramic substrates are available for different application
Passive Component
Passive component attaching is available. It can be placed on the top or bottom side of the package
Ceramic BGA
High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages
