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Product
Overview |
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HFC-BGA (High Performance FC-BGA), a thermally enhanced FC-BGA, is the composite package of FC-BGA with heatspreader made of Cu, AI. The heatspreader is used to extend the heat conduction area by connecting itself to the rear side of the silicon chip.
This method desensitizes the performance deviation out of the chip size, lowers the thermal resistance of junction-to-case (θJC), and enables the external heat sink or fan to work more effectively. HFC-BGA can produce 6~8 watts of power dissipation under natural convection. |
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| Application |
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| Computer:
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| Graphics/chipsets for PCs, servers and high-end applications, microprocessors for PCS & servers. |
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| Telecommunications:
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| Networking products (e.g. LAN), switching, transmission, cellular base stations. |
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Features |
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Substrate:
4
layer laminate, 4~8 layer build-up, ceramic, and
PTFE substrates are available.
Therma Lids:
Heat
spreaders made of Cu with Ni plating, Aluminum,
Ceramic, AlSiC.
Passive Component:
Passive
component attaching. It can be placed on the top
or bottom side of the package.
Ceramic BGA:
High
Pb solder ball with eutectic solder paste improves
board level reliability performance
of ceramic packages. |
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Reliability |
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| Package
Level |
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| Board
Level(Contact ASE R&D for details.) |
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Design
Rule |
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| Packaging
Capability/Outline Dimension (All
units are in mm.) |
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| The
alphabetical notation refers to: |
| A
Pkg Overall thickness |
| A1
Stand-off |
| b
Ball diameter |
| c
Substrate thickness |
| e
Ball pitch |
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| (1mm=39.37mil;
1mil=25.4um) |
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Performance |
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| Electrical
(Contact ASE R&D for details.) |
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| Thermal
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| The thermal
data of flip chip packages is related to several
factors, number of substrate layers, substrate thickness,
substrate material, die size, and I/O pad layout. |
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| FC-BGA/HFC-BGA |
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| The above thermal
data is for reference only. |
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Standard
Process/Materials |
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| Optional
process: Dry packing/molding/heat spreader planting
(for FC-BGA) |
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Package
Offering |
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| Notes:1.
HiTCE HFC CBGA is thermally enhanced flip chip package
with HiTCE ceramic substrate. |
| 2.
SBS HFCBGA (Side-by side high performance flip chip
BGA) is thermally enhanced
flip chip package with multiple chips on a package. |
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| Packing
& Shipping |
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