

 |
| Feature |
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Environmentally friendly
Better MSL performance than Pb containing package
Robust solder joint life
Compatibility with regular assembly process |


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| Introduction |
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| Qualification
Plan |
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| Qualified
laminate package in MSL3/260°C |


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| Laminate
Package (MSL3/260°C) |
| |
| Pb
free package offerings |
| |
PBGA 596 40x40mm
PBGA 618 37.5x37.5mm
HSBGA 672 37.5x37.5mm
Cavity down CSBGA 352 35x35mm
LBGA 484 23x23mm *
LBGA 672 27x27mm *
LFGA 208 (single die) 15x15mm and 17x17mm
LFGA 208 (stack die) 15x15mm
TFBGA 48 7x7mm
VFBGA 46 7.9x6.5mm
Film BGA 96 8x8mm |
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| Green
package offerings (green compound+green substrate) |
| |
PBGA 618 37.5x37.5mm
LFBGA 208 (single die) 15x15mm
TFBGA 64 10x13mm
TFBGA 48 7x7mm
VFBGA 56
Film BGA 280 16x16mm
Wafer bumping 16x16mm |


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