Pb Free Solution
 

* PBGA
* HSBGA
* MCM BGA
* Low & Thin
* Cavity Down
* QFP
* LQFP/TQFP
* TSOP
* SO series
* PLCC
* PDIP
* BCC++


Solution Overview

 
The pressure to eliminate lead in electronic interconnections from both the legislative and competitive sides are driving manufacturing companies to research and develop lead-free materials and technologies.

Since 1999, ASE has investigated and tested the performance of various types of lead free solders to generate alternative semiconductor package applications. The package reliability was tested at 260 degree celsius peak re-flow profile. ASE? lead free packages meet JEDEC's moisture sensitivity level requirements of 3 and will qualify packages achieving MSL 2 by the end of 2003.


Feature
 
Environmentally friendly
Better MSL performance than Pb containing package
Robust solder joint life
Compatibility with regular assembly process


Introduction
 
 


Qualification Plan
 
Qualified laminate package in MSL3/260°C


Laminate Package (MSL3/260°C)
 
Pb free package offerings
 
PBGA 596 40x40mm
PBGA 618 37.5x37.5mm
HSBGA 672 37.5x37.5mm
Cavity down CSBGA 352 35x35mm
LBGA 484 23x23mm *
LBGA 672 27x27mm *
LFGA 208 (single die) 15x15mm and 17x17mm
LFGA 208 (stack die) 15x15mm
TFBGA 48 7x7mm
VFBGA 46 7.9x6.5mm
Film BGA 96 8x8mm
 
Green package offerings (green compound+green substrate)
 
PBGA 618 37.5x37.5mm
LFBGA 208 (single die) 15x15mm
TFBGA 64 10x13mm
TFBGA 48 7x7mm
VFBGA 56
Film BGA 280 16x16mm
Wafer bumping 16x16mm


Leaded Package (MSL3/260°C)
 
Pb free and green package offerings
 
PQFP 208 28x28mm **
HQFP 208 (with heat slug) 28x28mm **
LQFP 208 28x28mm **
LQFP 216 24x24mm *
LQFP 64 Epad 14x20mm *
LQFP 176 Epad 24x24mm *
LQFP 216 Epad 24x24mm *
Low alpha LQFP 216 24x24mm
TQFP 44 10x10mm *
TQFP 64 14x14mm *
TQFP 100 14x14mm **
TQFP 100 Epad 14x14mm **
TQFP EP 80 (12x12)mm
TSOP 48 (Cu & A-42) 12x18.4mm
SOP 28 713x331mil
SSOP 56 725x295mil
SOJ 24 675x300mil
PDIP 40 2050x550mil
PLCC 84 1153x1153mil
BCC++ 48 7x7mm
 
More Pb free package offerings
 
PLCC 20 leads *
MCR 240 (with BT substrate) 32x32mm *
QFP 208 28x28mm *
LQFP 144 20x20mm *
TQFP 44 10x10mm *
TQFP 100 14x14mm *
 
 
 
Packages without marking are available from ASE Kaohsiung, Taiwan.
Packages marked " *" are available from ASE Penang, Malaysia.
Packages marked " ** " are available from both factories.