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Memory Memory Card
 


Product Overview

 
ASE flash memory card solutions integrate design and packaging capabilities covering substrate designs with different flash options, assembly thin wafer technology, multi stacked die processes, low profile bonding, laser cutting technology and surface mount process with passive components, and memory card test. ASE offers packaging solutions for popular flash memory cards, including SD, mini SD and micro SD cards.


Applications
 
Cellular phone
MP3 player
Digital camera
PDA


Features

 
High efficiency substrate design
12 inch wafer grinding capacity
Stacked die assembly experience
Thin wafer assembly capacity
Turnkey solution


Package Offering
 
Product Size(mm) L/C Packaging Origination
Micro SD 11.0x15x0.7 8 2 dies stacked + side by side SD card assocation
Mini SD 21.5x20x1.4 11 2 dies stacked + side by side SD card assocation
SD 32.0x24x2.1 9 2 dies stacked + side by side SD card assocation

For more information, please contact ASE sales office.


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