ASE Global

Memory FBGA for DRAM

Product Overview

FBGA (Fine pitch Ball Grid Array) are BGA packages that follow JEDEC standard package outline dimensions for DRAM products. To meet high speed DRAM requirements, FBGA can be designed the shorter trace length to provide better electrical performance than that of TSOP. In addition to better electrical performance, FBGA’s smaller package size allows higher memory density on memory module than that of TSOP package.

Applications

FBGA at ASE is specifically designed for speed higher than 400MHz DRAM package and module.

Features

10X10.5 to 11x13mm packages are available

Good electrical and thermal performance

Low assembly and test cost solution

Low profile

JEDEC MO-207J standard outlines conforming

RoHS and Halogen free conforming

Good solder joint reliability / Meet JEDEC drop test/TCT requirement

Reliability

Package Level

Test Item	Test Condition	Duration	Sample Size	Criteria
Precondition	85°C / 65% RH followed 3x IR (260+5/-0°C)	168 hr	77/lot*3	(0,1)
Temperature Cycle Test (TCT)	-65°C to +150°C 30 minutes/cycle Air to Air	200/500/1000 cycle	77/lot*3	500 cycles (0,1)
Highly Accelerated Stress Test (HAST)	110°C, 85%RH Vdd=1.9V	168/264 hr	77/lot*3	264 hours (0,1)
Pressure Cooker Test (PCT)	121°C, 100%RH	96/192 hr	77/lot*3	96 hours (0,1)
High Temperature Storage (HTS)	150°C	168/500/1000 hr	26/lot*3	1000 hours (0,1)

For more information, please contact ASE sales office.