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IC packaging (a.k.a. IC assembly) is one
of the essential processes and technologies in IC manufacture,
connecting the bare die to the PCB. It serves as a reliable
and easily testable vehicle for susceptible chips. The requirements
for the new generation of electronic devices are features
of our advanced IC packaging: low profile, high power dissipation,
and better performance in terms of voltage and reliability.
ASE, among the largest IC packaging companies
in the world, provides versatile, reliable and value-added
services, from the conventional PTH (plated-through-hole)
packaging to flip-chip BGAs with over 1500 I/O.
This section is a repository of information
about ASE’s package offerings and capabilities. It
provides an overview of each package type in our product
families, which includes the features, applications, design
rules, relevant reliability, performance data, etc.
We also welcome you to contact the local ASE
office near you if you need further discussion of a
particular product type, its technical data or assistance
in package selection.
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