ASE provides a complete range of semiconductor testing services to our customers, including front-end engineering testing, wafer probing, final testing of logic, mixed signal, and memory semiconductors, and other test-related services. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.

Front-end Engineering Testing

In front-end engineering testing services, we help customers develop customized test programs (software) and related hardware to test their semiconductors on advanced test equipment.

In addition, we also perform the following services:

- Electrical verification to assess whether a semiconductor device complies with a variety of different operating specifications

- Reliability analysis to assess the long-term reliability of the semiconductor and its suitability of use for intended applications

- Failure analysis when a semiconductor device does not function to specifications during either the electrical verification or reliability testing processes.

Wafer Probing

In wafer probing, we carry out visual inspection and electrical testing of processed wafers to ensure that they meet our customers' specifications.

Aside from 150mm and 200mm wafers, the equipments of handling 300mm wafers are well installed and trained. Volume production has already begun since 2002 Q3.

ASE is also the first subcontractor to hand bumped wafer sort in 2001. Currently the sort experience is more than 35,000 wafers ever since.

Wafer Sort Capability

Final Testing

In the final testing of logic and mixed signal semiconductors, we test devices with leads ranging from the single digits to several hundreds and operating frequencies up to several gigahertz on test equipments from major international manufacturers. We have, by far, the largest installed base of test equipment among independent service providers.

In memory testing, we provide final testing services for a variety of memory products, including static random access memory (SRAM), dynamic random access memory (DRAM), etc.

We also provide a range of additional test-related services, including burn-in testing, visual inspection, singulated top marking, dry pack, and tape and reel.

If you would like to know more about our test capabilities, please contact our worldwide sales team.