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06/17/2008 ASE Packages One Billion Bluetooth Devices for CSR
02/20/2008 ASE Receives Supplier of the Year Award from Broadcom


 
09/28/2007 ASE Group and NXP Semiconductors Embark on a New Assembly and Test Joint Venture in Suzhou, China
09/06/2007 ASE and Mitsui Sign Cross-licensing Agreement
03/20/2007 ASE Selected by Qimonda for Substrate Supplier Partnership


08/29/2006 ASE Selected by Medtronic to Package its Sophisticated Integrated Circuits for Medical Devices
05/03/2006 ASE Innovates at SemiTech Taipei 2006


12/09/2005 ASE Receives Strategic Supplier Recognition From Agere Systems
11/01/2005 ASE Sponsors 2005 FSA Suppliers Expo TAIWAN and Semiconductor Leaders Forum
09/27/2005 ASE Sponsors 2005 FSA Suppliers Expo and Conference
08/30/2005 Freescale Honors ASE with 2005 Supplier Recognition Award
06/30/2005 ASE Receives Supplier of the Year Award from Vitesse Semiconductor
05/24/2005 ASE Announces Milestone Shipment of 100 Million Bluetooth Chips
05/02/2005 Advanced Semiconductor Engineering, Inc. Press Release
05/01/2005 Advanced Semiconductor Engineering, Inc. Press Release
04/28/2005 ASE and FlipChip International Sign Worldwide Licensing Agreement


11/10/2004 ASE Group Sponsors 2004 FSA Suppliers Expo Taiwan
09/22/2004 ASE Group Sponsors 2004 FSA Suppliers Expo and Technical Conference
07/12/2004 ASE Group Celebrates 20th Anniversary
07/01/2004 ASE Ranked Amongst Business Week's INFO TECH 100 List
06/02/2004 Advanced Semiconductor Engineering, Inc. Completes Acquisition of NEC Packaging and Test Plant
03/30/2004 Nordic VLSI Addresses Environmental Concerns with ASE's Green QFN Package
02/25/2004 Conexant Recognizes ASE with 2003 Supplier of the Year Award
02/03/2004 ASE to Acquire IC Packaging and Testing Operation from NEC Electronics


12/17/2003 ASE Develops Packaging Solutions for austriamicrosystems' Secure Wireless Communication Device to be Implemented on future Mercedes high end models
12/11/2003 ASE Receives 2003 Strategic Supplier Award from Agere Systems
10/28/2003 ASE and Compeq to Set Up IC Substrate Joint Venture
10/28/2003 Group Affiliates ASE (Chung-Li) Inc. and ASE Material Inc. to Merge with ASE Inc.
10/14/2003 ISE Labs Singapore Renaming to ASE Singapore
09/03/2003 ASE Hosts Annual Technology Forum on Packaging and Test
07/23/2003 ASE Receives Raytheon Supplier Scorecard Award
07/08/2003 ASE Marks Volume Production Milestone on Wafer Level Packaging Technology
04/16/2003

ASE Qualifies Wire-bond and Flip-chip Assemblies for ICs Using TSMC's All-copper, 0.13-micron Low-K Dielectric Process Technology
04/09/2003 ASE Completes Internal Development of Electroplated Wafer Bumping Technology
03/27/2003 Silicon Laboratories and ASE Announce Milestone Shipment of 10 Million Tested Integrated Circuits
02/24/2003 Altera Qualifies ASE's Lead-Free Packages
02/18/2003 ASE Announces Collaboration with AMD in Flip Chip Development for
Chipset Assembly


12/11/2002 ASE Embarks on Volume Production of Image Sensor Packages
11/26/2002 ASE's Packaging Technology Enables Wireless Communication Chips from Leading European IC Design House
11/25/2002 ASE Receives Sub-contracting Supplier of the Year Award from Tower Semiconductor
10/29/2002 ASE Announces Volume Production Capability in 300mm Wafer Flip Chip Bumping
10/18/2002 ISE Labs and MuAnalysis Form Alliance to Enhance Analytical Test Services for the Canadian Semiconductor Industry
07/25/2002 ASE Advances in Fine Pitch Wire Bonding Technology
07/15/2002 ASE to Collaborate with IBM on Next Generation Flip Chip Packaging Technology
07/11/2002 ISE Offers Semiconductor Companies Worldwide Remote Access to Broad Range of Test Platforms
06/03/2002 ASE Hosts Third-Annual Tech Forum on Semiconductor Packaging and Test
05/24/2002 Announcement on the Migration of Email Domain Addresses to @aseglobal.com
04/08/2002 ASE and MTBS to Jointly Develop Next Generation Large Silicon Flip Chip Package
03/25/2002 ASE's Packaging Technology Enables Wireless Communication Chips from Leading European IC Design House
03/11/2002 ASE Ranked No. 1 Supplier in FSA's 2002 Wafer and Packaging Demand Survey
02/22/2002 ASE's Fine Pitch Bonding Technology Accelerates CSR's BluetoothTM Developments


11/20/2001 ASE Pushes Ahead with 300mm Solder Bumping Technology
10/25/2001 ASE Introduces Multi-Package Ball Grid Array Technology
10/11/2001 ASE Launches Volume Production of Wafer-level Chip Scale Packages
08/14/2001 President Chen Visits ASE Kaohsiung Factory In Appreciation of ASE's Contribution to Taiwan's Semiconductor Industry
07/11/2001 TSMC, Motorola and ASE are First to Launch RosettaNet Supply Chain Software
07/11/2001 ASE Announces Its Success In Achieving the RosettaNet Work-In-Process Milestone
06/20/2001 ASE Named Supplier of the Year by Zoran Corporation
06/05/2001 VIA Unveils New 0.13 Micron Version VIA C3(tm) Processor at Computex Taipei 2001
05/31/2001 ASE First to Offer World-leading SCSP and SiP Package Technologies
03/27/2001 ASE Inc Receives Intel's Preferred Quality Supplier Award
03/06/2001 K&S Licenses Copper Ball Bonding Technology To Advanced
Semiconductor Engineering
02/22/2001 ASE Unveils New Chip Manufacturing Technologies
02/20/2001 ASE and Conexant to Exchange
01/19/2001 ASE Licenses Kulicke & Soffa's Flip Chip Bumping Technology


 
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