| ASE's bumping lines are experienced in supporting Flip Chip CSP to wafer level CSP. | |
| Wafer size | 150 mm, 200 mm and 300 mm |
| IC final pad metallization | Al/Si/Cu, Al/Cu, Pure Cu, Al cap on Cu pad |
| Process | Standard bumping, Re-passivation, redistribution, wafer level CSP (UltraCSP®) |
| Solder composition | 63Sn/37Pb, Low alpha 63Sn/37Pb, 90Pb/10Sn, Pb-free |
| Bump pitch | Array:
160  m~500
mPeripheral: 125 m~500
m |
| Die size | 0.8 mmx0.9 mm~23 mmx26 mm |
| Bump count | 6~3600 bumps/die |
| Bump height | 70  m~150
m |