ASE Chairman and Founder, Jason Chang receives the 2017 Dale Carnegie Leadership Award which recognized a company that places strong focus on developing human resources, innovation and organizational creativity.
ASE receives 2016 Asia Responsible Entrepreneurship Award,
ASE30 Environmental Conservation Fund demonstrates commitment to Taiwan’s environmental conservation and protection efforts.
ASE named Industry Group Leader 2016 on the Dow Jones Sustainability Indices, selected as the Semiconductors and Semiconductor Equipment Industry Group Leader and included for the first time as an index component on the iconic Dow Jones Sustainability World index - a global index which only includes companies that lead the field in terms of sustainability.
ASE is the sole company from Taiwan and the only outsourced semiconductor manufacturer on the Climate A List 2016 issued by CDP.
ASE and TDK established ASE Embedded Electronics Incorporated at Kaohsiung in Taiwan, a joint venture specializing in manufacturing IC embedded substrates by adopting SESUB® (Semiconductor Embedded SUBstrate) technology to drive towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.
Honored with SEMI Award for advancement in copper wire bonding technology that recognizes the significant impact and leadership made by ASE in bringing solutions for cost-effective manufacturing and high level performance to market.
Awarded Forbes Asia Fabulous 50 companies 2014, and also rated the best of Asia-Pacific’s biggest publicly traded companies.
30th Anniversary of ASE Group
Acquired Wuxi Tongzhi Microelectronics Co., Ltd. from TOSHIBA Semiconductor (Wuxi) Co., Ltd. to strengthen the capability of ASE for providing IC assembly and testing services in China.
Universal Scientific Shanghai, a subsidiary of Universal Scientific Co. Ltd., completed its IPO on the Shanghai Stock Exchange on February 2012.
ASE Korea and the city of Paju signed an MOU for the further development of ASE's communication IC packaging and testing production facilites in the industrial zone.
ASE completed the acquisition of Yang Ting Corporation. Yang Ting is based in Taichung, Taiwan, R.O.C., and specializes in discrete packaging and testing services.
Won the Contribution Award from the National Invention and Creation Award of Ministry of Economic Affairs.
ASE Group was ranked as Taiwan 3th place and Asia top 10 in 2011 Taiwan / China / Asia Info Tech 100 by Business Next.
Acquired EEMS Test Singapore Pte Ltd. to enabling ASE Singapore to further develop its test business.
Acquired Universal Scientific Industrial Co., Ltd. to expend footprint from chip-level assembly and testing to downstream board-level PCB/module assembly.
ASE Kunshan officially started operation in 2010 and strategically located in Yanhu Industry Park in Kunshan Jiangsu province to provide the integrated for ASE's assembly, test, substrate, and board assembly manufacturing capabilities.
25th anniversary of ASE Group.
Started volume production of Copper Wire Bonding at ASE manufacturing sites.
Acquired Aimhigh's manufacturing facility. Located in Wei Hai city, Shandong, China and specialized in lower pin count products, ASE offers significant cost advantages for discrete product manufacturing.
ASE and NXP Semiconductors launched ASEN, a joint venture providing IC packaging and test services in Suzhou, China, and offering a variety of package types, such as low pin count QFN, LFBGA, SO, TSSO, and other common packages for mobile applications.
Integrated GAPT in Shanghai, China and renamed the company ASE Assembly & Test (Shanghai) Ltd.
Transferred existing semiconductor material business department to its wholly owned subsidiary, ASE Electronics Inc., to strengthen core competencies and to further develop material business.
ASE and Powerchip formed joint venture to establish PowerASE Technology Inc, focusing on packaging and test services for the memory IC market.
Started volume production of Wafer Level CSP (WLCSP).
Acquired NEC Electronics' IC packaging and test operations in Takahata, Japan. The acquisition enabled ASE to enhance its presence and ramp up market share with Japanese IDM (integrated device manufacturers) customers.
Incorporated ASE Shanghai to establish materials (substrates) capabilities.
Celebrated the 20th Anniversary of ASE Group.
Combined subsidiaries ASE (Chung Li) Inc. and ASE Material Inc., setting an efficient and effective standard for overall resource utility.
In a joint venture with Compeq Manufacturing Co., Ltd., Taiwan's largest substrate manufacturing service supplier, the company formed ASE-Compeq Technologies Inc. specialized in IC substrate to further reinforce the capability of substrate design and manufacturing.
Became the world's largest IC backend manufacturing company with annual revenues surpassing the nearest competitor.
Won the assembly and test service providers from Fabless Semiconductor Association.
Won the Outstanding Award from the Industrial Technology Development Award of Ministry of Economic Affairs in Taiwan.
Established ASE ChungLi Intelligent Industrial Park to provide comprehensive turnkey services under one roof in Northern Taiwan.
Completed development and opened facility to handle 300mm wafer bumping.
ASE Inc. started trading on the New York Stock Exchange through the issue of ADR.
Commanced volume production of flip chip packaging.
Through ASE Test Limited, purchased a controlling stake in ISE Labs, the largest IC test company in the US, a strategic acquisition that strengthened ASE's position as a leader in IC test services.
Acquired Motorola's manufacturing facilities in Chungli, Taiwan and Paju, Korea.
Obtained controlling interest in Universal Scientific Industrial Co., Ltd. (USI), expanding into the scope of systems assembly.
ASE Test Limited started trading on Taiwan Stock Exchange through the issue of TDR.
Awarded QS 9000 certification for quality management.
Awarded ISO 14001 certification for environment quality management.
Established in-house flip chip assembly and test capabilities.
Accredited SAC Level 2 by the Semiconductor Assembly Council.
ASE Test Limited listed on Nasdaq; the first Taiwan-based company to make a public offering in the US.
Incorporated ASE Material Inc. to establish in-house inter-connection materials (substrates) capabilities.
Established packaging and testing facilities in Penang, Malaysia.
Entered semiconductor test market by acquiring ASE Test Limited.
ASE Inc. began trading on the Taiwan Stock Exchange.
Brothers Jason Chang and Richard Chang established Advanced Semiconductor Engineering, Inc. Operations began at its first factory in Kaohsiung, Taiwan in July 1984.