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Cu Pillar

Product Overview

As electronic devices trend further towards smaller, thinner, lighter, and higher performance characteristics, bump size likewise decreases meaning fine pitch becomes essential. ASEs Cu pillar bumps in flip chip packaging technology is the most effective method for fine-pitch interconnection for these package types.

Applications

Consumer
Camcorders
Digital Camera
DVD
WiMAX

Computer
Voltage regulators
High-speed Memory Card
PC Peripherals

Telecommunication
Pagers
Cellular handsets
GPS

Features

Standoff between chip and substrate is more stable.
Good electrical performance and high reliability
- Cu pillar bumps do not easily cause fatigue by electromigration and thermal.
Fine pitch solution.
Cu pillar bumps do not cause bump bridging between adjacent bumps and they distribute current uniformly. Higher elastic modulus.
Lower cost.