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ASE Announces the Opening of Its Weihai Phase 3 Manufacturing Facility

Weihai, Shangdong, May 29th, 2012 – Advanced Semiconductor Engineering Incorporated (ASE, TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor packaging and test company, today celebrated the official opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building is part of ASE's expansion plans to increase its manufacturing capacity for discrete packaging and test.

The official opening ceremony was hosted by Dr. Tien Wu, chief operating officer of the ASE Group and J.H. Lee, general manager of ASE Weihai. The event was also graced by senior officials of Weihai city including Mr Tang Guan Yuan, vice mayor and Mr Zhang Jian Jun, director of the economic development zone. 
The new building occupies a land space of 5,120 square meters with a built up floor space of 30,560 square meters. ASE plans to recruit an additional 2,000 employees in engineering, development and operations for the new facility. 
In 2008, ASE acquired the Weihai manufacturing facility from Aimhigh Corporation. The Weihai facility is focused on the packaging and testing of discrete semiconductor devices such as TO-92, Power and SOP/DFN which are widely used in automotive, consumer, computing, communications and industrial applications. Over the years, ASE has invested about $200 million on building expansion, equipment purchase, facility upgrading and R&D. 
According to Gartner, discrete semiconductor revenuesis $20.6 billion in 2011. ASE estimated that the amount spent on semiconductor packaging and test is approximately $6 billion.  With the advent of cloud computing and increased semiconductor content in various electronics applications, there is a significant opportunity for growth in discrete semiconductor manufacturing. ASE Weihai is fully committed to deliver a high standard of service, support and manufacturing capacity to meet these future demands from our customers. 
About ASE Group

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. The Group generated sales revenues of US$6 billion in 2011 and employs over 50,000 people worldwide. For more information about the ASE Group, visit