Press Release
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ASE Kunshan Facility - Production Lines Continue Operation Normally

ASE Group upholds its commitment to the safety and security of its employees

 Taipei, August 04, 2014 – Advanced Semiconductor Engineering Inc,(TAIEX: 2311, NYSE: ASX)the world's largest outsourced semiconductor assembly and test company, announces today that the management and staff of the company would like to extend their deepest condolences to the families and victims of the unfortunate factory explosion incident which occurred on Saturday, August 2nd in Kunshan, Jiangsu Province, China.

The ASE Group has a manufacturing facility located at No. 373, Songnan Road, Qiandeng, Kunshan, Jiangsu Province; which is approximately 18 kilometers away and 20 minutes' drive from the site of Saturday's explosion. Our Kunshan facility has not been affected by this incident and our production is operating normally.

ASE would like to emphasize that it has in place an environmental, health and safety (EHS) management system to ensure the safety of the workplace and work scope of its employees and minimize the risks of exposure to accidents. ASE's EHS management includes defining clear goals of public safety within the workplace, the organization of a management team to oversee and assess risks, implementing all the measures across the organization, continuous improvement and promoting awareness, as well as effective management during and after a crisis. Our highest priority would be to strengthen all these measures to provide greater assurance and security to our employees, the general public and our customers.


About ASE Group

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. The Group generated sales revenues of US$7.4 billion in 2013 and employs over 60,000 people worldwide. For more information about the ASE Group, visit