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ASE announces signing ceremony with TDK on the inauguration of ASE Embedded Electronics Incorporated

Establishing System-in-Package dominance through industry collaboration with market leaders in cutting-edge semiconductor manufacturing technologies

Kaohsiung, September 4, 2015 Advanced Semiconductor Engineering, Inc (TSE: 2311, NYSE: ASX) today announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK Corporation and local officials.

On May 8th, 2015, both ASE and TDK entered into an agreement to establish a joint venture company, named ASE Embedded Electronics Incorporated, to manufacture IC embedded substrates using TDK’s SESUB®(Semiconductor Embedded in SUBstrate) technology. The ASE Embedded Electronics manufacturing facility is to be located in the Nantze Export Processing Zone, Kaohsiung City, Taiwan. ASE’s System-in-Package (SiP) solutions using SESUB technology will offer a robust embedded solution in enabling a wide number of applications such as PMIC, sensors, RF tuners, and many more. Through the joint venture company, ASE aims to leverage ASE’s capabilities in advanced packaging, test and module level solutions with TDK’s proven proprietary embedded technology to address escalating market needs for semiconductor miniaturization.

As a leader in SiP technology, ASE continues to expand its product and service portfolio through collaboration with key suppliers and partners. "Such alliances enable ASE to strengthen its SiP ecosystem and offer our customers a complete suite of solutions for integrating dozens of chips into smaller and thinner spaces in the advent of portable and wearable devices and the Internet of Things," said Dr. Tien Wu, COO, ASE Group.

About ASE Group

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. The Group generated sales revenues of US$8.5 billion in 2014 and employs over 68,000 people worldwide. For more information about the ASE Group, visit