Press Release
  • Press Room

ASE Receives Certification as a Qualified ICP Exporter from the Taiwan Bureau of Foreign Trade

Taipei, Taiwan, December 01, 2015 - Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, today announced that it has been certified by the Ministry of Economic Affairs, Bureau of Foreign Trade (BOFT) as a qualified Internal Compliance Program (ICP) exporter. The certification is valid for 3 years and allows ASE to apply for multiple export permits for strategic high tech goods.

Violation of any export control regulation often results in hefty fines, significant business disruptions and serious damages to a company’s reputation. As such, compliance to complex trade regulations is a strategic and operational imperative of ASE’s export business. ASE, with assistance from the BOFT, has developed and implemented internal compliance programs to reduce the risks of export control violation through employee training and policies that manage the flow of goods from the quotation stage, order processing to order fulfilment. Frequent audits by professional third party companies and self-assessment are conducted to ensure the integrity and robustness of ASE’s compliance measures.

ASE has also recently received the ISO 15408-EAL6 certification, a globally recognized standard that endorses a company for its capability to manage high security semiconductor products. Together with the ICP certification, ASE’s customers would benefit from the ease of goods flow, a secure production process to a shortened time to market. The ISO 15408-EAL6 and ICP certifications elevate ASE as a global company that respects governing laws, and further strengthen the company’s competitive leadership.

About ASE Group

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group. The Group generated sales revenues of US$8.5 billion in 2014 and employs over 68,000 people worldwide. For more information about the ASE Group, visit